The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 19, 2000
Filed:
Jul. 30, 1998
Applicant:
Inventors:
Hermen Liu, Taoyuan Hsien, TW;
Gino J Shian, Hsinchu, TW;
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ; G01R / ;
U.S. Cl.
CPC ...
438 15 ; 438 14 ;
Abstract
A method of testing a ball grid array (BGA) integrated circuit (IC) package such that no solder balls are attached to the BGA IC package when burn-in testing using a burn-in testing socket is carried out. In this method, landings on the substrate of the BGA IC package directly contact the test contacts of the burn-in testing socket. Furthermore, the substrate of the BGA IC package is cleaned with hydrogen peroxide solution before solder balls are attached onto the landings of the BGA IC substrate.