Gino J Shian

Title: Gino J Shian: Innovator in Integrated Circuit Testing

Introduction

Gino J Shian is a notable inventor based in Hsinchu, Taiwan. He has made significant contributions to the field of integrated circuit testing, particularly with his innovative methods that enhance the reliability of electronic components. His work is recognized for its practical applications in the semiconductor industry.

Latest Patents

Gino J Shian holds a patent for a method of testing a ball grid array (BGA) integrated circuit (IC) package. This method ensures that no solder balls are attached to the BGA IC package during burn-in testing when using a burn-in testing socket. The technique involves direct contact between the landings on the substrate of the BGA IC package and the test contacts of the burn-in testing socket. Additionally, the substrate is cleaned with hydrogen peroxide solution before the solder balls are attached, ensuring optimal testing conditions. He has 1 patent to his name.

Career Highlights

Gino is currently employed at United Microelectronics Corporation, a leading company in the semiconductor industry. His role involves developing and refining testing methods that improve the performance and reliability of integrated circuits. His expertise has been instrumental in advancing the company's testing protocols.

Collaborations

Gino has worked closely with his coworker, Hermen Liu, to further enhance the methodologies used in integrated circuit testing. Their collaboration has led to improved processes that benefit the overall efficiency of testing procedures.

Conclusion

Gino J Shian's innovative approach to testing integrated circuits has made a significant impact in the semiconductor field. His contributions continue to influence the industry, ensuring that electronic components meet high standards of reliability and performance.