Chiayi, Taiwan

Hau-Yi Hsiao

USPTO Granted Patents = 13 

Average Co-Inventor Count = 5.2

ph-index = 2

Forward Citations = 7(Granted Patents)


Company Filing History:


Years Active: 2019-2025

where 'Filed Patents' based on already Granted Patents

13 patents (USPTO):

Title: Innovations of Hau-Yi Hsiao

Introduction

Hau-Yi Hsiao is a prominent inventor based in Chiayi, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 12 patents. His work focuses on advanced techniques for wafer processing and integrated chip structures.

Latest Patents

Hau-Yi Hsiao's latest patents include innovative techniques for wafer stack processing. This patent describes an integrated chip structure that features a first substrate with horizontally extending surfaces that wrap around each other in a closed loop. Another notable patent involves a semiconductor wafer seal ring that includes a protrusion extending into a trench in the semiconductor substrate. This design enhances the functionality and reliability of semiconductor devices.

Career Highlights

Hau-Yi Hsiao is currently employed at Taiwan Semiconductor Manufacturing Company Limited, a leading firm in the semiconductor industry. His expertise and innovative approaches have positioned him as a key player in the development of cutting-edge semiconductor technologies.

Collaborations

Hau-Yi has collaborated with notable colleagues, including Cheng-Hsien Chou and Cheng-Yuan Tsai, who contribute to the dynamic environment of innovation at their workplace.

Conclusion

Hau-Yi Hsiao's contributions to semiconductor technology through his patents and collaborations highlight his role as a significant inventor in the industry. His work continues to influence advancements in integrated chip structures and wafer processing techniques.

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