The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 21, 2021
Filed:
May. 05, 2020
Taiwan Semiconductor Manufacturing Co., Ltd., Hsin-Chu, TW;
Yung-Lung Lin, Taichung, TW;
Cheng-Hsien Chou, Tainan, TW;
Cheng-Yuan Tsai, Chu-Pei, TW;
Kuo-Ming Wu, Zhubei, TW;
Hau-Yi Hsiao, Chiayi, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
The present disclosure relates to a method for forming a multi-dimensional integrated chip structure. In some embodiments, the method may be performed by bonding a second substrate to an upper surface of a first substrate. A first edge trimming cut is performed along a first loop and extends into a first peripheral portion of the second substrate. A second edge trimming cut is performed along a second loop and extends into a second peripheral portion of the second substrate and into the first substrate. A third edge trimming cut is performed along a third loop and extends into a third peripheral portion of the first substrate.