Tainan, Taiwan

Cheng-Hsien Chou

USPTO Granted Patents = 124 

Average Co-Inventor Count = 3.8

ph-index = 10

Forward Citations = 495(Granted Patents)


Inventors with similar research interests:


Location History:

  • Tainan County, TW (2011)
  • Tainan, TW (2008 - 2024)

Company Filing History:


Years Active: 2008-2025

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124 patents (USPTO):

Title: Cheng-Hsien Chou: Innovative Mind with 100 Patents

Introduction:

In the world of innovations and patents, some individuals stand out for their exceptional contributions. Cheng-Hsien Chou, a brilliant inventor hailing from Tainan, Taiwan, has left an indelible mark with his inventive spirit and remarkable achievements. With a whopping 100 patents to his name, Chou's expertise in various fields has revolutionized industries and paved the way for future advancements.

Latest Patents:

Chou's ingenuity and dedication are evident in his latest patents, exemplifying his ability to tackle complex challenges and develop cutting-edge solutions. One such invention is the "Multi-wafer capping layer for metal arcing protection." This patent presents a novel method for forming an integrated chip structure, involving the formation of interconnect layers, edge trimming processes, and the use of dielectric capping structures. These advancements greatly enhance the performance and reliability of integrated circuits.

Another notable patent is his contribution to the field of air compressors with the invention of an "Air Compressor." This innovation introduces an air stop sheet mounted on the piston, featuring a unique bending section that creates an air flowing space. By optimizing air channel flow, Chou's invention improves efficiency and functionality in air compressor systems.

Career Highlights:

Throughout his career, Chou has worked with renowned companies, leaving a significant impact with his inventive prowess. One of his prominent collaborations is with Taiwan Semiconductor Manufacturing Company Limited (TSMC). TSMC is renowned for its semiconductor manufacturing capabilities, and Chou's contributions to the company's intellectual property portfolio have played a vital role in their success. His work has helped propel TSMC to the forefront of the semiconductor industry.

Collaborations:

Chou's innovative mindset extends beyond individual achievements, as he has also collaborated with exceptional minds in the field. Notable coworkers include Sheng-Chau Chen and Cheng-Yuan Tsai. Collaborations like these fuel creativity and foster a collaborative environment, leading to groundbreaking inventions that shape our technologies.

Conclusion:

Cheng-Hsien Chou's exceptional career and impressive patent portfolio are a testament to his unwavering commitment to innovation. His latest patents, such as the "Multi-wafer capping layer for metal arcing protection" and the "Air Compressor," showcase his ability to push boundaries and solve complex problems. With his extensive experience and collaborations with industry giants like TSMC, Chou continues to contribute tirelessly to the field of inventions and patents, making him a true visionary in the world of technology.

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