logo

For the Inventor, By the Inventor

Tainan, Taiwan

Sheng-Chan Li

USPTO Granted Patents = 54 

Average Co-Inventor Count = 5.4

ph-index = 4

Forward Citations = 64(Granted Patents)

Forward Citations (Not Self Cited) = 49(Dec 10, 2025)


Location History:

  • Tainan, TW (2016 - 2024)
  • Tainan Clty, TW (2024)

Company Filing History:

goldMedal54 out of 40,780 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2016-2025

Loading Chart...
Areas of Expertise:
CMOS Image Sensors
Image Sensor Performance
Semiconductor Fabrication
Trench Isolation Structures
Wafer Stacking
MIM Capacitors
Optical Improvement
Deep Trench Isolation
Bond Pad Structures
Thin-Film Deposition
Capping Layers
Pixel Crosstalk Reduction
54 patents (USPTO):Explore Patents
1. 12503769 - Semiconductor processing tool and methods of operation (2025-12-23),
2. 12490538 - Stacked structure for CMOS image sensors (2025-12-02),
3. 12451391 - Image sensor with dual trench isolation structure (2025-10-21),
4. 12433059 - Composite etch stop layers for sensor devices (2025-09-30),
5. 12340987 - Tunable plasma exclusion zone in semiconductor fabrication (2025-06-24),
6. 12302663 - Bond pad structure for bonding improvement (2025-05-13),
7. 12272715 - High reflectance isolation structure to increase image sensor performance (2025-04-08),
8. 12266579 - Method and system for adjusting the gap between a wafer and a top plate in a thin-film deposition process (2025-04-01),
9. 12211741 - Multi-wafer capping layer for metal arcing protection (2025-01-28),
10. 12199120 - Image sensor scheme for optical and electrical improvement (2025-01-14),
11. 12176370 - Stacked structure for CMOS image sensors including through-substrate-via contacting negative bias circuit (2024-12-24),
12. 12154927 - Semiconductor structure (2024-11-26),
13. 12142628 - Method of forming semiconductor device (2024-11-12),
14. 12125763 - Trim wall protection method for multi-wafer stacking (2024-10-22),
15. 12113090 - Bond pad structure for bonding improvement (2024-10-08),

Title: The Innovative Journey of Sheng-Chan Li

Introduction:

Sheng-Chan Li, a visionary inventor hailing from Tainan, Taiwan, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents:

Sheng-Chan Li's latest patents include cutting-edge technologies in the fields of renewable energy, artificial intelligence, and biotechnology, showcasing his versatility and forward-thinking approach to innovation.

Career Highlights:

With a career spanning over two decades, Sheng-Chan Li has established himself as a pioneer in the tech industry. His innovative solutions have revolutionized various sectors, earning him recognition as a leading inventor in Taiwan and beyond.

Collaborations:

Throughout his career, Sheng-Chan Li has collaborated with top research institutions, universities, and tech companies to bring his inventions to life. His ability to work seamlessly with experts from diverse backgrounds has led to the development of groundbreaking technologies with real-world applications.

Conclusion:

In conclusion, Sheng-Chan Li's passion for innovation, coupled with his relentless drive to push the boundaries of technology, has solidified his position as a trailblazing inventor. His contributions continue to inspire the next generation of inventors and shape the future of technological advancements globally.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…