Introduction: Gurpreet Singh, based in Hillsboro, Oregon, is an accomplished inventor with a remarkable portfolio of 19 patents. His work primarily focuses on advancing integrated circuit (IC) technology, significantly impacting the field with innovative solutions and methodologies.

Latest Patents: Among Gurpreet's latest patents are several groundbreaking inventions that enhance the fabrication of integrated circuits. One notable patent is titled "Directed self-assembly enabled patterning over metal layers using assisting features." This invention describes IC devices that incorporate patterned conductive layers like metal gratings and gate layers, utilizing a directed self-assembly (DSA) process augmented by DSA assisting features. These features facilitate the creation of patterned layers even over non-uniform substrate characteristics.

Another significant patent authored by Gurpreet is "Contact over active gate structures using directed self-assembly for advanced integrated circuit structure fabrication." This patent details an integrated circuit structure that includes multiple gate structures with conductive trench contact structures, employing a unique method of using a di-block-co-polymer to improve signal integrity and device performance.

Career Highlights: Gurpreet Singh has made substantial contributions to the technology sector through his tenure at leading companies. Notably, he has worked at Intel Corporation and International Business Machines Corporation (IBM), where he applied his expertise in semiconductor technology and contributed to numerous innovative projects.

Collaborations: Throughout his career, Gurpreet has collaborated with talented professionals in his field, including notable coworkers such as Eungnak Han and Manish Chandhok. Together, these inventors have pushed the boundaries of technology, driving advancements in integrated circuit design and fabrication.

Conclusion: Gurpreet Singh stands out as a significant innovator in the realm of integrated circuits. With 19 patents underscoring his contributions, his ongoing work promises to shape the future of semiconductor technology. His commitment to innovation continues to inspire new levels of achievement within the industry.

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