The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Aug. 26, 2025

Filed:

Sep. 24, 2021
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Manish Chandhok, Beaverton, OR (US);

Elijah V. Karpov, Portland, OR (US);

Mohit K. Haran, Hillsboro, OR (US);

Reken Patel, Portland, OR (US);

Charles H. Wallace, Portland, OR (US);

Gurpreet Singh, Portland, OR (US);

Florian Gstrein, Portland, OR (US);

Eungnak Han, Portland, OR (US);

Urusa Alaan, Hillsboro, OR (US);

Leonard P. Guler, Hillsboro, OR (US);

Paul A. Nyhus, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/535 (2006.01); H10D 30/01 (2025.01); H10D 30/62 (2025.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/76805 (2013.01); H01L 21/76895 (2013.01); H01L 23/535 (2013.01); H10D 30/024 (2025.01); H10D 30/6211 (2025.01);
Abstract

Contact over active gate (COAG) structures with conductive trench contact taps are described. In an example, an integrated circuit structure includes a plurality of gate structures above a substrate, each of the gate structures including a gate insulating layer thereon. A plurality of conductive trench contact structures is alternating with the plurality of gate structures, each of the conductive trench contact structures including a trench insulating layer thereon. One of the plurality of conductive trench contact structures includes a conductive tap structure protruding through the corresponding trench insulating layer. An interlayer dielectric material is above the trench insulating layers and the gate insulating layers. A conductive structure is in direct contact with the conductive tap structure of the one of the plurality of conductive trench contact structures.


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