Beaverton, OR, United States of America

Manish Chandhok

This inventor holds 89 USPTO granted patents and 23 published patent applications and 7 EPO patents, primarily in Integrated Circuit Design (CPC class H01L23-5226). Top assignee: Intel Corporation. Active years: 2003-2026.

USPTO Granted Patents = 89 

% Patents Active = 70.8

 

Average Co-Inventor Count = 4.0

ph-index = 6

Forward Citations = 167(Granted Patents)

Forward Citations (Not Self Cited) = 137(Dec 10, 2025)


Inventors with similar research interests:

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Location History:

  • Portland, OR (US) (2003 - 2009)
  • Beaverton, OR (US) (2006 - 2024)

Company Filing History:


Years Active: 2003-2026

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Areas of Expertise:
Integrated Circuits
Interconnect Structures
Capacitor Architectures
Advanced Lithography
Self-Aligned Features
Directed Self-Assembly
Patterning Techniques
Conductive Via Fabrication
Metal Oxide Layers
Grating Replication
Electro-Migration Resistance
3D Vertical RRAM
89 patents (USPTO):Explore Patents

Title: Innovations and Contributions of Manish Chandhok in the Field of Patent Engineering

Introduction

Manish Chandhok, located in Beaverton, Oregon, is a significant contributor to the field of innovations and patent engineering. With an impressive portfolio of 77 patents, his work primarily revolves around advanced technologies in integrated circuit (IC) devices and lithography techniques. His inventions reflect a commitment to pushing boundaries in semiconductor fabrication and self-assembly processes, marking him as a key figure in the technology landscape.

Latest Patents

Among his latest accomplishments, Manish has developed a patent for "Self-assembled guided hole and via patterning over grating." This innovation describes integrated circuit devices with vias deposited in a regular array, specifically a hexagonal pattern. The process outlined in this patent involves the deposition of a guiding pattern over a metal grating, followed by layering a diblock copolymer that self-assembles into an array of cylinders over the metal grating's portions. The transformative potential of this technology lies in its ability to convert the polymer layer into a hard mask, enabling selective etching and via formation.

Another notable patent pertains to "Advanced lithography and self-assembled devices." This work discusses advanced lithography techniques that achieve sub-10 nm pitch patterning and outlines the fabrication methods for self-assembled devices. These innovations pave the way for more sophisticated semiconductor manufacturing, underscoring Manish's role at the forefront of technology.

Career Highlights

Manish Chandhok's career has been marked by his tenure at Intel Corporation, where he has contributed to groundbreaking developments in semiconductor technologies. His extensive experience in the field is reflected in the numerous patents he has spearheaded, demonstrating his dedication to innovation and excellence.

Collaborations

Collaboration has been a vital component of Manish's career. He has worked alongside talented peers such as Kevin Lai Lin and Florian Gstrein, leveraging their collective expertise to drive advancements in technology. These collaborations not only enhance the quality of their projects but also foster an environment of creativity and shared knowledge.

Conclusion

Manish Chandhok stands out as a prolific inventor whose contributions to patent engineering and semiconductor technology are both innovative and impactful. With 77 patents to his name and ongoing collaboration with outstanding colleagues, he continues to shape the future of the industry. His work serves as an inspiration for future inventors and innovators seeking to make their mark in the realm of technology.

Profile summary based on public USPTO records.
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