The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 03, 2026

Filed:

Mar. 03, 2022
Applicant:

Intel Corporation, Santa Clara, CA (US);

Inventors:

Leonard P. Guler, Hillsboro, OR (US);

Chanaka D. Munasinghe, Portland, OR (US);

Manish Chandhok, Beaverton, OR (US);

Charles H. Wallace, Portland, OR (US);

Tahir Ghani, Portland, OR (US);

Assignee:

Intel Corporation, Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/528 (2006.01); H01L 21/768 (2006.01); H01L 23/522 (2006.01); H01L 23/532 (2006.01); H10D 64/01 (2025.01); H10D 64/23 (2025.01); H10D 84/01 (2025.01); H10D 84/03 (2025.01); H10D 84/83 (2025.01);
U.S. Cl.
CPC ...
H01L 23/5283 (2013.01); H01L 21/76897 (2013.01); H01L 23/5226 (2013.01); H01L 23/5329 (2013.01); H10D 64/01 (2025.01); H10D 64/258 (2025.01); H10D 84/0149 (2025.01); H10D 84/038 (2025.01); H10D 84/83 (2025.01);
Abstract

An integrated circuit includes (i) a first transistor device having a first source or drain region coupled to a first source or drain contact, and a first gate electrode, (ii) a second transistor device having a second source or drain region coupled to a second source or drain contact, and a second gate electrode, (iii) a first dielectric material above the first and second source or drain contacts, (iv) a second dielectric material above the first and second gate electrodes, (v) a third dielectric material above the first and second dielectric materials, and (vi) an interconnect feature above and conductively coupled to the first source or drain contact. In an example, the interconnect feature comprises an upper body of conductive material extending within the third dielectric material, and a lower body of conductive material extending within the first dielectric material, with an interface between the upper and lower bodies.


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