Missouri City, TX, United States of America

Gene A Frantz

This inventor holds 63 USPTO granted patents and 1 published patent application, primarily in System In Package (CPC class H01L). Top assignees: Texas Instruments Corporation, Octavo Systems LLC. Active years: 1980-2023.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Gene A Frantz. Retrieved from https://idiyas.com/inventor/gene-a-frantz

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 63 (Patent Applications = 1)

% Patents Active = 82.5

Average Co-Inventor Count = 2.7

ph-index = 13

Forward Citations = 987(Granted Patents)

Forward Citations (Not Self Cited) = 981(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Irving, TX (US) (1980 - 1983)
Lubbock, TX (US) (1981 - 1987)
Missouri City, MO (US) (2004)
Missouri City, TX (US) (1992 - 2008)
Sugar Land, TX (US) (2009 - 2023)

Company Filing History:

49 out of 29,869

Texas Instruments Corporation

Years Active: 1980-2023

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Areas of Expertise:

System In Package

Mixed Signal Computer

EMI Shield

Analog Memory Cells

Synchronous DRAM

Memory Circuit

Data Transfer

Image Processing

Modem Technology

Substrate Design

Circuit Mounting

Consumer Electronics

63 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11610844 - High performance module for SiP (2023-03-21),

2. 11502030 - System and method of assembling a system (2022-11-15),

3. 11373720 - Analog memory cells with valid flag (2022-06-28),

4. 11347478 - Analog arithmetic unit (2022-05-31),

5. 11308290 - Mixed signal computer architecture (2022-04-19),

6. 11302648 - EMI shield for molded packages (2022-04-12),

7. 11257803 - System in a package connectors (2022-02-22),

8. 11211369 - Service module for SIP devices (2021-12-28),

9. 11171651 - Mixed signal computer (2021-11-09),

10. 11171126 - Configurable substrate and systems (2021-11-09),

11. 11157676 - Method for routing bond wires in system in a package (SiP) devices (2021-10-26),

12. 10867979 - Circuit mounting structure and lead frame for system in package (SIP) devices (2020-12-15),

13. 10714430 - EMI shield for molded packages (2020-07-14),

14. 10204890 - Substrate for system in package (SIP) devices (2019-02-12),

15. 9720520 - Imaging input/output with shared spatial modulator (2017-08-01),

Title: Gene A. Frantz: Innovator in High-Performance Modules and System-in-Package Technologies

Introduction: Gene A. Frantz, based in Missouri City, Texas, is a renowned inventor with an impressive portfolio of 63 patents. His contributions to the field of electrical engineering and semiconductor technology have significantly impacted the development of high-performance modules and System-in-Package (SiP) devices.

Latest Patents: Among his recent innovations are two noteworthy patents. The first describes a high-performance module specifically designed for use in System-in-Package applications. This module features one or more interposer substrates that support high-performance components and devices, ensuring efficient operation and interconnectivity. The second patent pertains to a novel substrate for SiP that includes spaced apart electrically conductive landing pads. These pads facilitate electrical connections with components, enabling streamlined assembly of systems through efficient interconnections achieved via bond wires.

Career Highlights: Gene A. Frantz has made significant strides in his career by being associated with prestigious companies, including Texas Instruments and Octavo Systems. His extensive experience and innovations in these organizations highlight his deep understanding and dedication to advancing technology in his field.

Collaborations: Throughout his career, Frantz has worked alongside talented professionals such as Masashi Hashimoto and John Victor Moravec. These collaborations have undoubtedly enriched his inventive process, contributing to the success of his projects and patents.

Conclusion: Gene A. Frantz exemplifies the spirit of innovation, with a robust body of work that continues to influence the industry. His patents, particularly in the realm of high-performance modules and System-in-Package design, underscore his commitment to advancing technology and improving device performance in the electronics sector.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]

1 patent pending: