Inventors with similar research interests:
Location History:
- Irving, TX (US) (1980 - 1983)
- Lubbock, TX (US) (1981 - 1987)
- Missouri City, MO (US) (2004)
- Missouri City, TX (US) (1992 - 2008)
- Sugar Land, TX (US) (2009 - 2023)
Company Filing History:
Years Active: 1980-2023
Title: Gene A. Frantz: Innovator in High-Performance Modules and System-in-Package Technologies
Introduction: Gene A. Frantz, based in Missouri City, Texas, is a renowned inventor with an impressive portfolio of 63 patents. His contributions to the field of electrical engineering and semiconductor technology have significantly impacted the development of high-performance modules and System-in-Package (SiP) devices.
Latest Patents: Among his recent innovations are two noteworthy patents. The first describes a high-performance module specifically designed for use in System-in-Package applications. This module features one or more interposer substrates that support high-performance components and devices, ensuring efficient operation and interconnectivity. The second patent pertains to a novel substrate for SiP that includes spaced apart electrically conductive landing pads. These pads facilitate electrical connections with components, enabling streamlined assembly of systems through efficient interconnections achieved via bond wires.
Career Highlights: Gene A. Frantz has made significant strides in his career by being associated with prestigious companies, including Texas Instruments and Octavo Systems. His extensive experience and innovations in these organizations highlight his deep understanding and dedication to advancing technology in his field.
Collaborations: Throughout his career, Frantz has worked alongside talented professionals such as Masashi Hashimoto and John Victor Moravec. These collaborations have undoubtedly enriched his inventive process, contributing to the success of his projects and patents.
Conclusion: Gene A. Frantz exemplifies the spirit of innovation, with a robust body of work that continues to influence the industry. His patents, particularly in the realm of high-performance modules and System-in-Package design, underscore his commitment to advancing technology and improving device performance in the electronics sector.
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