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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10714430 B1

PDFFull Text
Date of Patent:
Jul. 14, 2020

Filed:

Jul. 20, 2018

Emi shield for molded packages

Applicant:

Octavo Systems Llc, Sugar Land, TX (US);

Inventors:

Masood Murtuza, Sugar Land, TX (US);

Peter Robert Linder, Sugar Land, TX (US);

Gene Alan Frantz, Sugar Land, TX (US);

Assignee:

OCTAVO SYSTEMS LLC, Sugar Land, TX (US);

Attorney:

Rothwell, Figg, Ernst & Manbeck, P.C.

Primary Examiner:

Cuong B Nguyen

Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01); H01L 23/16 (2006.01); H01L 23/498 (2006.01); H01L 23/31 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/56 (2013.01); H01L 23/16 (2013.01); H01L 24/17 (2013.01); H01L 23/3128 (2013.01); H01L 23/49816 (2013.01); H01L 23/49822 (2013.01); H01L 23/49827 (2013.01); H01L 23/49838 (2013.01); H01L 24/16 (2013.01); H01L 2224/16227 (2013.01); H01L 2224/16235 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/181 (2013.01); H01L 2924/3025 (2013.01);
Abstract

Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

Find Patent Forward Citations

Murtuza, Masood. (2020). Emi shield for molded packages (U.S. Patent No. 10714430). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/10714430

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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