The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Nov. 15, 2022
Filed:
Aug. 31, 2017
Applicant:
Octavo Systems Llc, Sugar Land, TX (US);
Inventors:
Masood Murtuza, Sugar Land, TX (US);
Erik James Welsh, Bellaire, TX (US);
Peter Linder, Sugar Land, TX (US);
Gene Alan Frantz, Sugar Land, TX (US);
Assignee:
OCTAVO SYSTEMS LLC, Sugar Land, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/11 (2006.01); H01L 23/498 (2006.01); H01L 25/16 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 23/48 (2006.01); H01L 23/495 (2006.01); H01L 23/00 (2006.01); H05K 1/18 (2006.01); H01L 25/065 (2006.01);
U.S. Cl.
CPC ...
H01L 23/49833 (2013.01); H01L 23/3107 (2013.01); H01L 23/481 (2013.01); H01L 23/49513 (2013.01); H01L 23/49838 (2013.01); H01L 23/5386 (2013.01); H01L 24/14 (2013.01); H01L 24/49 (2013.01); H01L 25/16 (2013.01); H05K 1/111 (2013.01); H05K 1/181 (2013.01); H01L 23/5385 (2013.01); H01L 25/0655 (2013.01); H01L 2224/04042 (2013.01); H01L 2224/48157 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/73265 (2013.01); H01L 2924/14 (2013.01); H01L 2924/1436 (2013.01); H01L 2924/14511 (2013.01); H01L 2924/15192 (2013.01); H01L 2924/15311 (2013.01); H01L 2924/19042 (2013.01); H01L 2924/19105 (2013.01); H01L 2924/19107 (2013.01);
Abstract
A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.