The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 26, 2021
Filed:
Sep. 18, 2017
Applicant:
Octavo Systems Llc, Sugar Land, TX (US);
Inventors:
Neeraj Kumar Reddy Dantu, Sugar Land, TX (US);
Masood Murtuza, Sugar Land, TX (US);
Gene Alan Frantz, Sugar Land, TX (US);
Assignee:
OCTAVO SYSTEMS LLC, Sugar Land, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/394 (2020.01); G06F 30/327 (2020.01); G06F 30/367 (2020.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06F 113/20 (2020.01); G06F 115/10 (2020.01); G06F 119/06 (2020.01);
U.S. Cl.
CPC ...
G06F 30/394 (2020.01); G06F 30/327 (2020.01); G06F 30/367 (2020.01); G06F 30/392 (2020.01); G06F 30/398 (2020.01); G06F 2113/20 (2020.01); G06F 2115/10 (2020.01); G06F 2119/06 (2020.01);
Abstract
Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.