The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Aug. 23, 2019
Applicant:
Octavo Systems Llc, Sugar Land, TX (US);
Inventors:
Masood Murtuza, Sugar Land, TX (US);
Erik James Welsh, Bellaire, TX (US);
Christopher Lloyd Reinert, Frisco, TX (US);
Gene Alan Frantz, Sugar Land, TX (US);
Assignee:
OCTAVO SYSTEMS LLC, Sugar Land, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 25/18 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/48 (2006.01); H01L 21/56 (2006.01); H01L 23/00 (2006.01);
U.S. Cl.
CPC ...
H01L 25/18 (2013.01); H01L 21/4846 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/5385 (2013.01); H01L 23/5386 (2013.01); H01L 24/48 (2013.01); H01L 25/50 (2013.01); H01L 2224/48227 (2013.01);
Abstract
A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.