The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 21, 2023
Filed:
Oct. 11, 2018
Applicant:
Octavo Systems Llc, Sugar Land, TX (US);
Inventors:
Gene Alan Frantz, Sugar Land, TX (US);
Masood Murtuza, Sugar Land, TX (US);
Erik James Welsh, Bellaire, TX (US);
Peter Robert Linder, Sugar Land, TX (US);
Assignee:
Octavo Systems LLC, Sugar Land, TX (US);
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/52 (2006.01); H01L 23/538 (2006.01); G11C 5/04 (2006.01); H01L 21/56 (2006.01); H01L 23/31 (2006.01); H01L 23/498 (2006.01); H01L 23/00 (2006.01); H01L 25/065 (2023.01);
U.S. Cl.
CPC ...
H01L 23/5383 (2013.01); G11C 5/04 (2013.01); H01L 21/56 (2013.01); H01L 23/3128 (2013.01); H01L 23/498 (2013.01); H01L 23/5386 (2013.01); H01L 24/16 (2013.01); H01L 25/0652 (2013.01); H01L 25/0655 (2013.01); H01L 25/0657 (2013.01); H01L 2924/15311 (2013.01);
Abstract
High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.