Texas Instruments Corporation

Octavo Systems LLC

Gene A Frantz

Masashi Hashimoto

John Victor Moravec

Jean-Pierre Dolait

Masood Murtuza

Peter Robert Linder

Erik James Welsh

Kun-Shan Lin

Laurence Ray Simar, Jr

Alva E Henderson

James F Hollander

Matthew Glen Hine

Kathleen M Goudie

Steven L Page

Neeraj Kumar Reddy Dantu

Pascal Dorster

Xiaolin Lu

Alan Gatherer

Michael Oliver Polley

George L Brantingham

Donald Phillip Shaver

Song Wu

Walter Y Chen

Basavaraj I Pawate

Domingo G Garcia

Douglas B Weiner

Jason Douglas Kridner

Dennis G Mannering

Pedro Ramon Gelabert

William R Hawkins

William C Timm

Terence J Riley

Jonathan G Bradley

Christopher Lloyd Reinert

Paul E Schurr

Timothy A Adcock

Jean P Dolait

Mark Nadeski

Subramaniyan Subuvenkat

James A Larimer

Rajan Chirayil

Richard R Chang

Bradley K Lane

Lisa A Ferrera

High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.

High performance module for SiP

A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.

System and method of assembling a system

The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.

Analog memory cells with valid flag

The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.

Analog arithmetic unit

The present disclosure describes a computer using a combination of analogue and digital components/elements used in a cohesive manner. Depending on the signals and data the computer manipulates, the analog processing elements and digital processing elements can be used separately, independently or in combination to optimize the computational results and the performance of the computer.

Mixed signal computer architecture

Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.

EMI shield for molded packages

A System in a Package (SiP) device is provided with an interconnect area or a physical space on a main SiP substrate that allows for a customizable second packaged component or device to be externally interconnected with the components on the main substrate of a packaged SiP to allow for modifications to the functionality of the components and devices on a primary (or main) SiP substrate.

System in a package connectors

The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.

Service module for SIP devices

Systems and devices for enabling the use of SIP subsystems to make a configurable system having a unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems such that desired characteristics and features for the configurable system are provided.

Configurable substrate and systems

The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.

Mixed signal computer

Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.

Method for routing bond wires in system in a package (SiP) devices

Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.

Circuit mounting structure and lead frame for system in package (SIP) devices

Substrate for system in package (SIP) devices

An image input/output apparatus and method includes a light source in optical communication with a spatial radiation modulator for projecting an output image and an image sensor for capturing an input image along a shared input/output path. In a described embodiment, the display of an output image and the capture of an input image is effected using a common spatial radiation modulator (SRM) in the form of a deformable mirror device (DMD).

Imaging input/output with shared spatial modulator

Growing community of inventors

Missouri City, TX, United States of America

Gene A Frantz