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For the Inventor, By the Inventor

Hsinchu, Taiwan

Fu-Jier Fan

This inventor holds 49 USPTO granted patents and 2 published patent applications, primarily in Semiconductor Manufacturing. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2002-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fu-Jier Fan. Retrieved from https://idiyas.com/inventor/fu-jier-fan

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 49 

% Patents Active = 91.8

Average Co-Inventor Count = 6.1

ph-index = 11

Forward Citations = 404(Granted Patents)


Location History:

  • Jubei, KR (2003)
  • Hsinchu Hsien, TW (2008)
  • Jubei, TW (2002 - 2009)
  • Hsinchu, TW (2010 - 2023)

Company Filing History:

goldMedal49 out of 43,553 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2002-2025

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Areas of Expertise:
Semiconductor Device
Manufacturing Method
Through Silicon Via
High Voltage Integration
Dishing Prevention
Spacer Structure
Floating Grid
Crown-Shaping Poly
Coupling Well Structure
OLED Merged Spacer Device
Polyimide Processing
Bumping Process
49 patents (USPTO):Explore Patents
1. 12500193 - Semiconductor device (2025-12-16),
2. 12414361 - Method of manufacturing a semiconductor device (2025-09-09),
3. 12272686 - Semiconductor structure and manufacturing method of the same (2025-04-08),
4. 12100706 - Semiconductor structure and method of forming thereof (2024-09-24),
5. 11710712 - Semiconductor device and manufacturing method of the same (2023-07-25),
6. 11705449 - Through silicon via design for stacking integrated circuits (2023-07-18),
7. 11646308 - Through silicon via design for stacking integrated circuits (2023-05-09),
8. 11569363 - Dishing prevention dummy structures for semiconductor devices (2023-01-31),
9. 11417649 - Semiconductor device (2022-08-16),
10. 11410995 - Semiconductor structure and method of forming thereof (2022-08-09),
11. 11302691 - High voltage integration for HKMG technology (2022-04-12),
12. 11063038 - Through silicon via design for stacking integrated circuits (2021-07-13),
13. 11004844 - Recessed STI as the gate dielectric of HV device (2021-05-11),
14. 10964692 - Through silicon via design for stacking integrated circuits (2021-03-30),
15. 10950708 - Dishing prevention dummy structures for semiconductor devices (2021-03-16),

Title: The Innovative Journey of Fu-Jier Fan

Introduction: Fu-Jier Fan, a pioneering inventor hailing from Hsinchu, Taiwan, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Fu-Jier Fan holds several patents in the field of semiconductor technology, including a recent patent for a novel method of enhancing chip performance through advanced cooling techniques.

Career Highlights: With a career spanning over two decades, Fu-Jier Fan has worked for leading tech companies in Taiwan, honing his skills in research and development. He has been instrumental in developing cutting-edge technologies that have revolutionized the semiconductor industry.

Collaborations: Throughout his career, Fu-Jier Fan has collaborated with top researchers and engineers in the field, fostering a culture of innovation and excellence. His collaborative efforts have led to the successful development of several groundbreaking technologies.

Conclusion: Fu-Jier Fan's relentless pursuit of innovation and his passion for pushing the boundaries of technology have solidified his position as a respected inventor in the global tech community. His contributions continue to inspire future generations of inventors and innovators.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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