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For the Inventor, By the Inventor

Taipei, Taiwan

Fang-Yu Liang

This inventor holds 11 USPTO granted patents. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2020-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Fang-Yu Liang. Retrieved from https://idiyas.com/inventor/fang-yu-liang

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 11

% Patents Active = 100.0

Average Co-Inventor Count = 2.2

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal11 out of 42,810 
 
Taiwan Semiconductor Manufacturing Comp. Ltd.
 patents

Years Active: 2020-2026

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11 patents (USPTO):Explore Patents
1. 12564077 - Method of forming package structure including antennas (2026-02-24),
2. 12148692 - Semiconductor package and manufacturing method thereof (2024-11-19),
3. 11973038 - Package structure with improved antenna patterns performance (2024-04-30),
4. 11682619 - Package component, semiconductor package and manufacturing method thereof (2023-06-20),
5. 11515274 - Semiconductor package and manufacturing method thereof (2022-11-29),
6. 11374303 - Package structure and method of fabricating the same (2022-06-28),
7. 11309242 - Package component, semiconductor package and manufacturing method thereof (2022-04-19),
8. 11233019 - Manufacturing method of semicondcutor package (2022-01-25),
9. 11094642 - Package structure (2021-08-17),
10. 10720399 - Semicondcutor package and manufacturing method of semicondcutor package (2020-07-21),
11. 10629539 - Package structure and method of fabricating the same (2020-04-21),

Title: Innovation Extraordinaire: Fang-Yu Liang Pioneering Technological Advancements

Introduction:

Fang-Yu Liang, a distinguished inventor hailing from Taipei, Taiwan, has made significant contributions to the field of semiconductor technology. With an impressive portfolio of 9 patents, Fang-Yu Liang continues to push the boundaries of innovation.

Latest Patents:

1. "Package Structure with Improved Antenna Patterns Performance": Fang-Yu Liang's innovative package structure enhances antenna patterns' performance, utilizing a die attach film and insulating encapsulant to optimize semiconductor functionality.

2. "Package Component, Semiconductor Package, and Manufacturing Method Thereof": This patent showcases Fang-Yu Liang's expertise in creating a package component with a functional circuit structure and seal ring structure for efficient semiconductor die coupling.

Career Highlights:

Fang-Yu Liang is a valuable asset at Taiwan Semiconductor Manufacturing Company Limited (TSMC). His relentless pursuit of excellence has led to groundbreaking advancements in semiconductor packaging and manufacturing processes, solidifying his reputation as a visionary in the industry.

Collaborations:

Fang-Yu Liang has collaborated closely with esteemed colleagues such as Kai-Chiang Wu and Chih-Chiang Tsao. Together, they have synergized their expertise to develop cutting-edge technologies that are shaping the future of semiconductor innovation.

Conclusion:

In conclusion, Fang-Yu Liang's innovative prowess and collaborative spirit have propelled him to the forefront of the semiconductor industry. His relentless dedication to driving technological advancements underscores his status as a trailblazer in the field. As Fang-Yu Liang continues to innovate and inspire, the world eagerly anticipates his future contributions to the realm of inventions and patents.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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