The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 28, 2022
Filed:
Mar. 28, 2019
Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;
Fang-Yu Liang, Taipei, TW;
Chih-Chiang Tsao, Taoyuan, TW;
Taiwan Semiconductor Manufacturing Company, Ltd., Hsinchu, TW;
Abstract
A package structure includes a semiconductor die, an insulating encapsulant, a redistribution layer and a plurality of antenna patterns. The semiconductor die has an active surface and a backside surface opposite to the active surface. The insulating encapsulant is encapsulating the semiconductor die. The redistribution layer is located on the active surface of the semiconductor die and over the insulating encapsulant. The plurality of antenna patterns is located over the semiconductor die, wherein the plurality of antenna patterns comprises a plurality of trenches located on a surface of the plurality of antenna patterns.