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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 10720399 B1

PDFFull Text
Date of Patent:
Jul. 21, 2020

Filed:

Oct. 25, 2018

Semicondcutor package and manufacturing method of semicondcutor package

Applicant:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Inventors:

Fang-Yu Liang, Taipei, TW;

Ching-Feng Yang, Taipei, TW;

Kai-Chiang Wu, Hsinchu, TW;

Assignee:

Taiwan Semiconductor Manufacturing Co., Ltd., Hsinchu, TW;

Attorney:

JCIPRNET

Primary Examiner:

Luan C Thai

Int. Cl.
CPC ...
H01L 21/311 (2006.01); H01L 23/66 (2006.01); H01L 23/00 (2006.01); H01L 23/538 (2006.01); H01L 23/552 (2006.01); H01L 23/31 (2006.01); H01L 25/16 (2006.01); H01L 21/56 (2006.01); H01L 21/683 (2006.01); H01L 21/3205 (2006.01); H01L 21/3105 (2006.01); H01L 21/288 (2006.01); H01L 21/321 (2006.01); H01L 21/48 (2006.01); H01Q 1/40 (2006.01);
U.S. Cl.
CPC ...
H01L 23/66 (2013.01); H01L 21/288 (2013.01); H01L 21/31053 (2013.01); H01L 21/31127 (2013.01); H01L 21/32051 (2013.01); H01L 21/32115 (2013.01); H01L 21/486 (2013.01); H01L 21/4857 (2013.01); H01L 21/561 (2013.01); H01L 21/568 (2013.01); H01L 21/6835 (2013.01); H01L 23/3121 (2013.01); H01L 23/3135 (2013.01); H01L 23/5383 (2013.01); H01L 23/5384 (2013.01); H01L 23/5386 (2013.01); H01L 23/5389 (2013.01); H01L 23/552 (2013.01); H01L 24/19 (2013.01); H01L 24/20 (2013.01); H01L 24/96 (2013.01); H01L 25/16 (2013.01); H01Q 1/40 (2013.01); H01L 24/24 (2013.01); H01L 2221/68359 (2013.01); H01L 2221/68381 (2013.01); H01L 2223/6672 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/211 (2013.01); H01L 2224/221 (2013.01); H01L 2224/24265 (2013.01);
Abstract

A semiconductor package includes an encapsulated semiconductor device, a first redistribution structure, an insulating layer, and an antenna. The encapsulated semiconductor device includes a semiconductor device encapsulated by an encapsulation material. The redistribution structure is disposed on a first side the encapsulated semiconductor device and electrically connected to the semiconductor device. The insulating layer is disposed on a second side of the encapsulated semiconductor device and comprises a groove pattern. The antenna is filled the groove pattern, wherein an upper surface of the antenna is substantially coplanar with an upper surface of the insulating layer.

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