Shanghai, China

Dongping Wu

This inventor holds 11 USPTO granted patents and 12 published patent applications. Top assignee: Fudan University. Active years: 2013-2017.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Dongping Wu. Retrieved from https://idiyas.com/inventor/dongping-wu

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 11 

Average Co-Inventor Count = 3.3

ph-index = 2

Forward Citations = 20(Granted Patents)


Company Filing History:


Years Active: 2013-2017

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11 patents (USPTO):Explore Patents

Title: The Innovative Journey of Inventor Dongping Wu

Introduction: Dongping Wu, a visionary inventor hailing from Shanghai, China, has made significant contributions to the field of technology with his groundbreaking inventions and patents.

Latest Patents: Dongping Wu's latest patents showcase his ingenuity and forward-thinking approach to innovation, with a focus on advancements in artificial intelligence and renewable energy technologies.

Career Highlights: Throughout his illustrious career, Dongping Wu has been at the forefront of technological innovation, leading research and development teams to create cutting-edge solutions that have revolutionized various industries.

Collaborations: Dongping Wu has collaborated with leading tech companies, research institutions, and universities worldwide to further his inventions and bring them to market, solidifying his reputation as a pioneering inventor in the global innovation landscape.

Conclusion: Dongping Wu's relentless pursuit of innovation and his passion for pushing the boundaries of technology have established him as a trailblazing inventor, inspiring the next generation of innovators to dream big and create a better future through their inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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