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For the Inventor, By the Inventor

Hsinchu, Taiwan

Der-Yuan Wu

USPTO Granted Patents = 29

Average Co-Inventor Count = 1.9

ph-index = 8

Forward Citations = 182(Granted Patents)


Location History:

  • Tour Fenn Jenn, TW (1997)
  • Taipei, TW (2000)
  • Hsin-Chu, TW (1997 - 2004)

Company Filing History:

goldMedal29 out of 7,082 
 
United Microelectronics Corp.
 patents

Years Active: 1997-2004

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29 patents (USPTO):Explore Patents
1. 6833318 - Gap-filling process (2004-12-21),
2. 6753244 - Method for manufacturing a copper fuse structure (2004-06-22),
3. 6746883 - Direct determination of interface traps in MOS devices (2004-06-08),
4. 6667534 - Copper fuse structure and method for manufacturing the same (2003-12-23),
5. 6432768 - Method of fabricating memory device and logic device on the same chip (2002-08-13),
6. 6406974 - Method of forming triple N well utilizing phosphorus and boron ion implantations (2002-06-18),
7. 6392924 - Array for forming magnetoresistive random access memory with pseudo spin valve (2002-05-21),
8. 6281069 - Method for forming deep trench capacitor under a shallow trench isolation structure (2001-08-28),
9. 6261898 - Method for fabricating a salicide gate (2001-07-17),
10. 6204109 - Method for forming a cylindrical capacitor (2001-03-20),
11. 6140201 - Method for fabricating a cylinder capacitor (2000-10-31),
12. 6124166 - Method of forming a lower electrode of a capacitor in a DRAM cell (2000-09-26),
13. 6121085 - Method of fabricating contact openings for dynamic random-access memory (2000-09-19),
14. 6110827 - Planarization method for self-aligned contact process (2000-08-29),
15. 6103606 - Method of fabricating a word line (2000-08-15),

Title: Der-Yuan Wu: Innovator in Semiconductor Technology

Introduction

Der-Yuan Wu is a prominent inventor based in Hsinchu, Taiwan. With an impressive portfolio of 29 patents, he has made significant contributions to the field of semiconductor technology. His work is instrumental in advancing the efficiency and capabilities of electronic components, particularly in manufacturing processes.

Latest Patents

Among his latest innovations, Wu has developed a gap-filling process that addresses the complexities of layering dielectric materials. This process involves the formation of a gap-filling material layer over a dielectric layer with an opening, ensuring that the surface is planarized for subsequent photolithography steps. Additionally, he has created a method for manufacturing a copper fuse structure, which simplifies the repair process using a laser tool and reduces manufacturing costs by utilizing an inner copper layer instead of the traditional aluminum.

Career Highlights

Wu's career is marked by his dedication to innovation within the semiconductor industry. He is currently associated with United Microelectronics Corporation, where he continues to push the boundaries of semiconductor manufacturing. His expertise and inventions play a crucial role in developing more efficient and cost-effective semiconductor devices.

Collaborations

Throughout his career, Wu has worked alongside talented colleagues such as Sun-Chieh Chien and Jason Jyh-shyang Jenq. These collaborations have fostered an environment of innovation and have led to the successful launch of several key projects in the semiconductor domain.

Conclusion

Der-Yuan Wu exemplifies the spirit of innovation in technology, particularly within the semiconductor industry. His numerous patents highlight his commitment to advancing manufacturing processes and enhancing the functionality of electronic components. As he continues his work at United Microelectronics Corporation, his contributions will undoubtedly shape the future of semiconductor technology.

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