The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 22, 2004
Filed:
May. 01, 2003
Applicant:
Inventors:
Der-Yuan Wu, Hsin-Chu, TW;
Chiu-Te Lee, Hsin-Chu, TW;
Assignee:
United Microelectronics Corp., Hsin-Chu, TW;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 2/144 ;
U.S. Cl.
CPC ...
H01L 2/144 ;
Abstract
A copper fuse structure and the method for fabricating the same is disclosed in this present invention. By employing an inner copper metal layer as a fuse, the copper fuse according to this invention can be easily zipped with a laser repair tool. Furthermore, the openings on a bonding pad and the fuse of the semiconductor structure can be identified with the method according to this invention. Moreover, in contrast of the fuse formed with an upper aluminum layer in the prior art, the cost of the fuse manufacturing is lower in the method according to this invention by fabricating the fuse with an inner copper layer.