The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 29, 2000
Filed:
Jun. 03, 1996
Applicant:
Inventors:
Assignee:
United Microelectronics Corp., Hsinchu, TW;
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
438675 ; 438631 ; 438697 ; 438699 ; 438700 ; 438702 ; 438760 ; 438740 ; 438959 ;
Abstract
A planarization method for self-aligned contact process which is suitable for use in DRAM processing. Prior to the formation of the bottom terminal layer of the capacitor, the substrate surface is first planarized, thus avoiding stringer effects and related bridging problems arising from an undulating surface profile, during subsequent etching of the defined pattern. Also according to the method of this invention, by covering the silicon substrate that has MOS transistors laid on top with first a deposition of an oxide layer, then an etch discriminatory layer, and finally a planarization layer, a substrate with a smooth, plane surface is obtained.