Guilderland, NY, United States of America

Deepika Priyadarshini

This inventor holds 60 USPTO granted patents and 3 published patent applications, primarily in Copper Interconnects (CPC class H01L). Top assignees: International Business Machines Corporation, Adeia Semiconductor Bonding Technologies Inc., Globalfoundries Inc.. Active years: 2015-2026.

USPTO Granted Patents = 60 (Patent Applications = 3)

% Patents Active = 55.0

Average Co-Inventor Count = 4.8

ph-index = 10

Forward Citations = 1,010(Granted Patents)

Forward Citations (Not Self Cited) = 909(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Guilerland, NY (US) (2017)
Philadelphia, PA (US) (2017 - 2019)
Guilderland, NY (US) (2015 - 2023)

Company Filing History:

52 out of 166,264

International Business Machines Corporation

patents

4 out of 1,907

Adeia Semiconductor Bonding Technologies Inc.

Adeia Semiconductor Solutions LLC

patents

Years Active: 2015-2026

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Areas of Expertise:

Copper Interconnects

Manganese Barrier Layer

Microwave Plasma Deposition

Low-Temperature Doping

Dielectric Structures

Fin-FETs

Nano Electronic Devices

Air Gap Structures

CMOS Device Leakage

Silicon Carbon Nitride

Substrate Bonding

Metal Oxide Liners

60 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12685112 - Method of forming copper interconnect structure with manganese barrier layer (2026-07-14),

2. 11804405 - Method of forming copper interconnect structure with manganese barrier layer (2023-10-31),

3. 11232983 - Copper interconnect structure with manganese barrier layer (2022-01-25),

4. 11186911 - Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same (2021-11-30),

5. 11066748 - Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same (2021-07-20),

6. 11043494 - Structure and method for equal substrate to channel height between N and P fin-FETs (2021-06-22),

7. 10770347 - Interconnect structure (2020-09-08),

8. 10593591 - Interconnect structure (2020-03-17),

9. 10580740 - Low-temperature diffusion doping of copper interconnects independent of seed layer composition (2020-03-03),

10. 10428428 - Microwave plasma and ultraviolet assisted deposition apparatus and method for material deposition using the same (2019-10-01),

11. 10381348 - Structure and method for equal substrate to channel height between N and P fin-FETs (2019-08-13),

12. 10366940 - Air gap and air spacer pinch off (2019-07-30),

13. 10325806 - Copper interconnect structure with manganese oxide barrier layer (2019-06-18),

14. 10256171 - Air gap and air spacer pinch off (2019-04-09),

15. 10242933 - Air gap and air spacer pinch off (2019-03-26),

Title: Deepika Priyadarshini: Pioneering Inventor from Guilderland

Introduction: Deepika Priyadarshini is a trailblazing inventor based in Guilderland, NY, known for her innovative contributions to various fields.

Latest Patents: Deepika Priyadarshini holds several patents in the areas of renewable energy technologies, sustainable agriculture, and healthcare devices.

Career Highlights: With a background in engineering and a passion for problem-solving, Deepika has led groundbreaking projects that have revolutionized industries and improved people's lives.

Collaborations: Throughout her career, Deepika has collaborated with top research institutions, leading companies, and talented individuals to bring her ideas to fruition and make a lasting impact.

Conclusion: Deepika Priyadarshini's dedication to innovation and her commitment to creating a better future through her inventions make her a true inspiration in the world of technology and beyond.