Average Co-Inventor Count = 5.4

ph-index = 10

Forward Citations = 264(Granted Patents)

Location History:

Modena, NJ (US) (2010)
Modena, NY (US) (1997 - 2017)

Company Filing History:

34 out of 164,108

International Business Machines Corporation

Chartered Semiconductor Manufacturing Ltd (corporation)

patents

4. 3 out of 131,214

Samsung Electronics Co., Ltd.

patents

5. 2 out of 30,028

Siemens Aktiengesellschaft

patents

6. 1 out of 52,711

Kabushiki Kaisha Toshiba

patents

7. 1 out of 19

Siemens Microelectronics Limited

patents

8. 1 out of 32

Siemens Components, Inc.

Applied Materials, Inc.

patents

11. 1 out of 14,705

Infineon Technologies Ag

patents

12. 1 out of 832,680

Other

patents

where one patent can have more than one assignee

Years Active: 1997-2017

where 'Filed Patents' based on already Granted Patents

36 patents (USPTO):Sort by Forward Citations

Abstract keywords

1. 9652729 - Metrology management (2017-05-16),

2. 7998880 - Low k dielectric CVD film formation process with in-situ imbedded nanolayers to improve mechanical properties (2011-08-16),

3. 7910484 - Method for preventing backside defects in dielectric layers formed on semiconductor substrates (2011-03-22),

4. 7888741 - Structures with improved interfacial strength of SiCOH dielectrics and method for preparing the same (2011-02-15),

5. 7847402 - BEOL interconnect structures with improved resistance to stress (2010-12-07),

6. 7820559 - Structure to improve adhesion between top CVD low-K dielectric and dielectric capping layer (2010-10-26),

7. 7749892 - Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devices (2010-07-06),

8. 7737029 - Methods of forming metal interconnect structures on semiconductor substrates using oxygen-removing plasmas and interconnect structures formed thereby (2010-06-15),

9. 7691736 - Minimizing low-k dielectric damage during plasma processing (2010-04-06),

10. 7678258 - Void-free damascene copper deposition process and means of monitoring thereof (2010-03-16),

11. 7615482 - Structure and method for porous SiCOH dielectric layers and adhesion promoting or etch stop layers having increased interfacial and mechanical strength (2009-11-10),

12. 7494938 - Advanced low dielectric constant organosilicon plasma chemical vapor deposition films (2009-02-24),

13. 7459388 - Methods of forming dual-damascene interconnect structures using adhesion layers having high internal compressive stresses (2008-12-02),

14. 7407605 - Manufacturable CoWP metal cap process for copper interconnects (2008-08-05),

15. 7402532 - Structure to improve adhesion between top CVD low-k dielectric and dielectric capping layer (2008-07-22),

Title: Darryl D Restaino: A Technological Pioneer in the World of Innovation

Introduction:

Darryl D Restaino, a visionary inventor based in Modena, NY, has established himself as a true pioneer in the realm of technology with his relentless drive for innovation and creating a better future through his inventive creations.

Latest Patents:

With an impressive portfolio of 36 patents, Darryl D Restaino continues to push the boundaries of technological advancements. His latest patents include groundbreaking inventions such as "Metrology Management," a method for efficiently managing metrology systems, and "Low k Dielectric CVD Film Formation Process with In-Situ Embedded Nanolayers," which aims to enhance the mechanical properties of dielectric stacks.

Career Highlights:

Having worked with renowned companies such as IBM (International Business Machines Corporation) and Sony Corporation, Darryl D Restaino has garnered invaluable experience and expertise in the field of technology. His innovative solutions have significantly contributed to the advancement of various industries.

Collaborations:

Throughout his career, Darryl D Restaino has collaborated with exceptional professionals in the field, including esteemed coworkers like John Anthony Fitzsimmons and Stephen McConnell Gates. These collaborations have resulted in the development of groundbreaking technologies and inventions that have had a profound impact on the tech landscape.

Conclusion:

In conclusion, Darryl D Restaino's passion for innovation, coupled with his unwavering dedication to creating transformative technologies, solidifies his position as a true trailblazer in the world of technology. His inventive spirit continues to drive him towards shaping a better future through his pioneering inventions.

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