The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 06, 2010
Filed:
Nov. 29, 2006
Griselda Bonilla, Fishkill, NY (US);
Christos D. Dimitrakopoulos, Somers, NY (US);
Son V. Nguyen, Yorktown Heights, NY (US);
Alfred Grill, White Plains, NY (US);
Satyanarayana V. Nitta, Poughquag, NY (US);
Darryl D. Restaino, Modena, NY (US);
Terry A. Spooner, Clifton Park, NY (US);
Griselda Bonilla, Fishkill, NY (US);
Christos D. Dimitrakopoulos, Somers, NY (US);
Son V. Nguyen, Yorktown Heights, NY (US);
Alfred Grill, White Plains, NY (US);
Satyanarayana V. Nitta, Poughquag, NY (US);
Darryl D. Restaino, Modena, NY (US);
Terry A. Spooner, Clifton Park, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
An interconnect in provided which comprises a copper conductor having both a top surface and a lower surface, with caps formed on the top surface of the metallic conductor. The cap is formed of dual laminations or multiple laminations of films with the laminated films including an Ultra-Violet (UV) blocking film and a diffusion barrier film. The diffusion barrier film and the UV blocking film may be separated by an intermediate film.