The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Mar. 16, 2010

Filed:

Jul. 10, 2003
Applicants:

Panayotis Andricacos, Croton-on-Hudson, NY (US);

Dean S. Chung, Essex Junction, VT (US);

Hariklia Deligianni, Tenafly, NJ (US);

James E. Fluegel, Rhinebeck, NY (US);

Keith T. Kwietniak, Highlandfalls, NY (US);

Peter S. Locke, Hopewell Junction, NY (US);

Darryl D. Restaino, Modena, NY (US);

Soon-cheon Seo, White Plains, NY (US);

Philippe M. Vereecken, Sleepy Hollow, NY (US);

Erick G. Walton, Shelburne, VT (US);

Inventors:

Panayotis Andricacos, Croton-on-Hudson, NY (US);

Dean S. Chung, Essex Junction, VT (US);

Hariklia Deligianni, Tenafly, NJ (US);

James E. Fluegel, Rhinebeck, NY (US);

Keith T. Kwietniak, Highlandfalls, NY (US);

Peter S. Locke, Hopewell Junction, NY (US);

Darryl D. Restaino, Modena, NY (US);

Soon-Cheon Seo, White Plains, NY (US);

Philippe M. Vereecken, Sleepy Hollow, NY (US);

Erick G. Walton, Shelburne, VT (US);

Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
C25D 5/00 (2006.01);
U.S. Cl.
CPC ...
Abstract

An improved method of stabilizing wet chemical baths is disclosed. Typically such baths are used in processes for treating workpieces, for example, plating processes for plating metal onto substrates. In particular, the present invention relates to copper plating baths. More particularly, the present invention relates to the stability of copper plating baths. More particularly, the present invention relates to prevention of void formation by monitoring the accumulation of deleterious by-products in copper plating baths.


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