Dean S Chung

Title: **Inventor Dean S Chung: Innovating Copper Deposition Processes**

Introduction

Dean S Chung is a notable inventor based in Essex Junction, Vermont, with a significant contribution to the field of materials science and electroplating. Holding five patents, he is recognized for his innovative approaches in improving copper deposition processes. His work is vital for advancements in electronic manufacturing and related fields.

Latest Patents

Among Dean S Chung’s latest patents are two key innovations focused on enhancing the stability and effectiveness of copper plating baths. The first patent, titled "Void-free damascene copper deposition process and means of monitoring thereof," presents an improved method for stabilizing wet chemical baths typically used in plating processes. This invention specifically addresses the stabilization of copper plating baths, aiming to prevent void formation by strategically monitoring harmful by-products within these baths.

His second patent, "Electroplated copper interconnection structure, process for making and electroplating bath," outlines a process that yields interconnect structures with copper conductors that are substantially free of internal seams or voids. This process employs an electroplating copper bath containing a specific concentration of dissolved cupric salt, enhancing the quality of the electroplated copper, particularly for structures with greater aspect ratios and narrow widths.

Career Highlights

Dean S Chung is affiliated with the International Business Machines Corporation (IBM), where his contributions have been influential in developing advanced electroplating techniques. His patents not only demonstrate his innovative capabilities but also reflect his commitment to addressing the needs of modern manufacturing challenges.

Collaborations

Throughout his career, Dean has collaborated with esteemed colleagues, including Erick G Walton and Hariklia Deligianni. These partnerships have further enriched his work, fostering an environment of creativity and shared expertise in tackling complex engineering problems.

Conclusion

Dean S Chung stands out as a prominent figure in the realm of innovation, particularly in copper deposition processes. His patents not only advance technical understanding but also hold significant implications for industries reliant on precise materials engineering. His continued work will undoubtedly shape the future of electroplating technology.