The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 07, 2001
Filed:
Dec. 28, 1999
Erick Gregory Walton, Underhill, VT (US);
Dean S. Chung, Essex Junction, VT (US);
Lara Sandra Collins, Georgia, VT (US);
William E. Corbin, Jr., Newburgh, NY (US);
Hariklia Deligianni, Edgewater, NJ (US);
Daniel Charles Edelstein, New Rochelle, NY (US);
James E. Fluegel, Rhinebeck, NY (US);
Josef Warren Korejwa, Charlotte, VT (US);
Peter S. Locke, Hopewell Junction, NY (US);
Cyprian Emeka Uzoh, Milpitas, CA (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A metal plating apparatus is described which includes a compressible member having a conductive surface covering substantially all of the surface of the substrate to be plated. The plating current is thereby transmitted over a wide area of the substrate, rather than a few localized contact points. The compressible member is porous so as to absorb the plating solution and transmit the plating solution to the substrate. The wafer and compressible member may rotate with respect to each other. The compressible member may be at cathode potential or may be a passive circuit element.