South Burlington, VT, United States of America

Erick G Walton

USPTO Granted Patents = 27 

Average Co-Inventor Count = 4.4

ph-index = 16

Forward Citations = 960(Granted Patents)


Location History:

  • Johnson, VT (US) (1988 - 1992)
  • So. Burlington, VT (US) (1989 - 1999)
  • South Burlington, VT (US) (1986 - 2000)
  • Wappingers Falls, NY (US) (2006)
  • Underhill, VT (US) (2000 - 2007)
  • Shelburne, VT (US) (2010)

Company Filing History:


Years Active: 1986-2010

where 'Filed Patents' based on already Granted Patents

27 patents (USPTO):

Title: **Erick G. Walton: A Pioneer in Copper Deposition Technologies**

Introduction

Erick G. Walton, based in South Burlington, Vermont, is a notable inventor with an impressive portfolio comprising 27 patents. His work primarily focuses on innovations in copper deposition processes, which have significant implications for the electronics industry.

Latest Patents

Among his latest patents, Walton has developed a "Void-free damascene copper deposition process and means of monitoring thereof." This invention introduces an enhanced method for stabilizing wet chemical baths used in various plating processes, specifically aimed at copper plating baths. By preventing the formation of voids in the plating process, Walton's work ensures higher-quality interconnections in electronic components.

Another significant patent by Walton is the "Electroplated copper interconnection structure, process for making, and electroplating bath." This innovation describes interconnect structures featuring copper conductors that are largely free of internal seams or voids. Utilizing an electroplating copper bath infused with a precise concentration of cupric salt, this process results in superior copper damascene structures.

Career Highlights

Walton's career includes pivotal roles at leading companies in the technology sector, particularly with IBM, where he contributed to advancements in semiconductor manufacturing processes. His inventions have greatly influenced the methods used in producing high-quality electronic components.

Collaborations

Throughout his career, Walton has collaborated with notable peers such as Ronald R. Uttecht and Dean S. Chung. These partnerships have facilitated the development of groundbreaking technologies that enhance the efficiency and effectiveness of copper plating methods.

Conclusion

Erick G. Walton's contributions to the field of copper deposition are invaluable, as evidenced by his extensive patent portfolio and collaborative efforts with other experts in the industry. His innovations not only push the boundaries of technology but also ensure the integrity and reliability of electronic systems that are foundational to modern technology.

This text is generated by artificial intelligence and may not be accurate.
Please report any incorrect information to support@idiyas.com
Loading…