The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 05, 2007
Filed:
Mar. 29, 2004
Panayotis C. Andricacos, Croton-On-Hudson, NY (US);
Steven H. Boettcher, Fishkill, NY (US);
Dean S. Chung, Essex Junction, VT (US);
Hariklia Deligianni, Edgewater, NJ (US);
James E. Fluegel, Rhinebeck, NY (US);
Wilma Jean Horkans, Ossining, NY (US);
Keith T. Kwietniak, Highlandfalls, NY (US);
Peter S. Locke, Hopewell Junction, NY (US);
Christopher C. Parks, Poughkeepsie, NY (US);
Soon-cheon Seo, White Plains, NY (US);
Andrew H. Simon, Fishkill, NY (US);
Erick G. Walton, Underhill, VT (US);
Panayotis C. Andricacos, Croton-On-Hudson, NY (US);
Steven H. Boettcher, Fishkill, NY (US);
Dean S. Chung, Essex Junction, VT (US);
Hariklia Deligianni, Edgewater, NJ (US);
James E. Fluegel, Rhinebeck, NY (US);
Wilma Jean Horkans, Ossining, NY (US);
Keith T. Kwietniak, Highlandfalls, NY (US);
Peter S. Locke, Hopewell Junction, NY (US);
Christopher C. Parks, Poughkeepsie, NY (US);
Soon-Cheon Seo, White Plains, NY (US);
Andrew H. Simon, Fishkill, NY (US);
Erick G. Walton, Underhill, VT (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
Interconnect structures with copper conductors being at least substantially free of internal seams or voids are obtained employing an electroplating copper bath containing dissolved cupric salt wherein the concentration of the salt is at least about 0.4 molar and up to about 0.5 molar concentration of an acid. Also provided are copper damascene structures having an aspect ratio of greater than about 3 and a width of less than about 0.275 μm and via openings filled with electroplated copper than is substantially free of internal seams or voids.