Wilma Jean Horkans

This inventor holds 18 USPTO granted patents, primarily in Electroplating Technology. Top assignee: International Business Machines Corporation. Active years: 1988-2007.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Wilma Jean Horkans. Retrieved from https://idiyas.com/inventor/wilma-jean-horkans

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 18

% Patents Active = 77.8

Average Co-Inventor Count = 4.5

ph-index = 11

Forward Citations = 500(Granted Patents)

Company Filing History:

18 out of 166,409

International Business Machines Corporation

patents

Years Active: 1988-2007

Loading Chart...

Areas of Expertise:

Electroplated Interconnections

Integrated Circuit Chips

Copper Plating Baths

Semiconductor Substrates

Lead-Free Soldering

Plating Solution Monitoring

Chemical Mechanical Polishing

Thin Film Fabrication

Barrier Layers

Electrodeposition Process

Mechanical Failures Prevention

Additive Control

18 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 7227265 - Electroplated copper interconnection structure, process for making and electroplating bath (2007-06-05),

2. 6974531 - Method for electroplating on resistive substrates (2005-12-13),

3. 6946716 - Electroplated interconnection structures on integrated circuit chips (2005-09-20),

4. 6709562 - Method of making electroplated interconnection structures on integrated circuit chips (2004-03-23),

5. 6592747 - Method of controlling additives in copper plating baths (2003-07-15),

6. 6570255 - Method for forming interconnects on semiconductor substrates and structures formed (2003-05-27),

7. 6429523 - Method for forming interconnects on semiconductor substrates and structures formed (2002-08-06),

8. 6406608 - Apparatus to monitor and add plating solution to plating baths and controlling quality of deposited metal (2002-06-18),

9. 6251787 - Elimination of photo-induced electrochemical dissolution in chemical mechanical polishing (2001-06-26),

10. 6224690 - Flip-Chip interconnections using lead-free solders (2001-05-01),

11. 6153043 - Elimination of photo-induced electrochemical dissolution in chemical (2000-11-28),

12. 6113769 - Apparatus to monitor and add plating solution of plating baths and (2000-09-05),

13. 5937320 - Barrier layers for electroplated SnPb eutectic solder joints (1999-08-10),

14. 5582927 - High magnetic moment materials and process for fabrication of thin film (1996-12-10),

15. 5385661 - Acid electrolyte solution and process for the electrodeposition of (1995-01-31),

Title: Wilma Jean Horkans: Innovator in Electroplating Technology

Introduction

Wilma Jean Horkans is a prominent inventor based in Ossining, NY (US), known for her significant contributions to the field of electroplating technology. With a remarkable portfolio of 18 patents, she has made substantial advancements in the development of interconnection structures and electroplating methods.

Latest Patents

Among her latest patents is the "Electroplated copper interconnection structure, process for making and electroplating bath." This invention focuses on creating interconnect structures with copper conductors that are substantially free of internal seams or voids. The process utilizes an electroplating copper bath containing dissolved cupric salt, with concentrations ranging from about 0.4 molar to 0.5 molar. Additionally, she has developed copper damascene structures with an aspect ratio greater than 3 and a width of less than 0.275 μm, featuring via openings filled with electroplated copper that is also free of internal seams or voids.

Another notable patent is the "Method for electroplating on resistive substrates." This method involves electroplating a conductive material onto a platable resistive metal barrier layer using a plating bath that may include a super filling additive and a suppressor. The technique allows for adjustments in current or voltage based on the area of the plated metal, resulting in a uniform electroplated layer of conductive material on the barrier layer.

Career Highlights

Wilma Jean Horkans has built her career at the International Business Machines Corporation (IBM), where she has been instrumental in advancing electroplating technologies. Her innovative work has not only contributed to the company's success but has also set new standards in the industry.

Collaborations

Throughout her career, Horkans has collaborated with esteemed colleagues, including Panayotis Constantinou Andricacos and Keith Thomas Kwietniak. These partnerships have fostered a collaborative environment that encourages innovation and the sharing of ideas.

Conclusion

Wilma Jean Horkans stands out as a leading inventor in the field of electroplating technology. Her contributions through her patents and work at IBM have significantly impacted the industry, showcasing her dedication to innovation and excellence.

Profile summary based on public USPTO records.

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]