The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 13, 2005

Filed:

Oct. 15, 2002
Applicants:

Panayotis Andricacos, Croton on Hudson, NY (US);

Hariklia Deligianni, Tenafly, NJ (US);

Wilma Jean Horkans, Ossining, NY (US);

Keith T. Kwietniak, Highlandfalls, NY (US);

Michael Lane, Cortlandt Manor, NY (US);

Sandra G. Malhotra, Beacon, NY (US);

Fenton Read Mcfeely, Ossining, NY (US);

Conal Murray, Yorktown Heights, NY (US);

Kenneth P. Rodbell, Sandy Hook, CT (US);

Philippe M. Vereecken, Sleepy Hollow, NY (US);

Inventors:

Panayotis Andricacos, Croton on Hudson, NY (US);

Hariklia Deligianni, Tenafly, NJ (US);

Wilma Jean Horkans, Ossining, NY (US);

Keith T. Kwietniak, Highlandfalls, NY (US);

Michael Lane, Cortlandt Manor, NY (US);

Sandra G. Malhotra, Beacon, NY (US);

Fenton Read McFeely, Ossining, NY (US);

Conal Murray, Yorktown Heights, NY (US);

Kenneth P. Rodbell, Sandy Hook, CT (US);

Philippe M. Vereecken, Sleepy Hollow, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C25D005/18 ; B32B015/00 ;
U.S. Cl.
CPC ...
Abstract

A conductive material is electroplated onto a platable resistive metal barrier layer(s) employing a plating bath optionally comprising a super filling additive and a suppressor, and by changing the current or voltage as a function of the area of plated metal. A structure is also provided that comprises a substrate, a platable metal barrier layer(s) located on the substrate and a relatively continuous uniform electroplated layer of a conductive material located on the platable resistive metal barrier layer.


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