The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Apr. 24, 2007

Filed:

Jan. 22, 2004
Applicants:

Jeffrey P. Gambino, Westford, VT (US);

William T. Motsiff, Essex Junction, VT (US);

Erick G. Walton, Underhill, VT (US);

Inventors:

Jeffrey P. Gambino, Westford, VT (US);

William T. Motsiff, Essex Junction, VT (US);

Erick G. Walton, Underhill, VT (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01F 7/127 (2006.01); H01L 21/44 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method for manufacturing high performance copper inductors includes providing a tall, Cu laminate spiral inductor is formed at the last metal level, and at the last metal +1 level, with the metal levels being interconnected by a bar via having the same spiral shape as the spiral metal inductors at the last metal level and the last metal +1 level. The method includes integrating the formation of thick inductors with the formation of bond pads, terminals and interconnect wiring with the last metal +1 wiring. Included are dielectric deposition and spacer formation steps, and/or selective deposition of a passivating metal such as CoWP, to passivate a Cu inductor that is formed after the last metal layer.


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