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For the Inventor, By the Inventor

Cupertino, CA, United States of America

Daniel Alexander Steigerwald

USPTO Granted Patents = 54 

 

Average Co-Inventor Count = 3.6

ph-index = 25

Forward Citations = 2,691(Granted Patents)

Forward Citations (Not Self Cited) = 2,656(Dec 10, 2025)


Inventors with similar research interests:


Location History:

  • Eindhoven, NL (2015 - 2017)
  • San Jose, CA (US) (2017 - 2019)
  • Cupertino, CA (US) (1999 - 2023)

Company Filing History:

goldMedal29 out of 133 
 
Lumileds Lighting U.s., LLC
 patents
silverMedal13 out of 21,384 
 
Koninklijke Philips Corporation N.V.
 patents
bronzeMedal11 out of 222 
 
Philips Lumileds Lighting Company LLC
 patents
4. 6 out of 900 
 
Lumileds LLC
 patents
5. 1 out of 9,638 
 
Hewlett-packard Company
 patents
where one patent can have more than one assignee

Years Active: 1999-2023

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Areas of Expertise:
Semiconductor Light Emitting Devices
Flip Chip LEDs
Passivation Techniques
LED Assembly
Ohmic Contacts
High-Powered Light Emitting Devices
Optical Scattering
Thermal Properties
Multi-Chip LED Assembly
III-Nitride Technology
Enhanced Luminous Efficiency
Photoresist Patterns
54 patents (USPTO):Explore Patents
1. 11658273 - Passivation for a semiconductor light emitting device (2023-05-23),
2. 10873013 - Passivation for a semiconductor light emitting device (2020-12-22),
3. 10170675 - P—N separation metal fill for flip chip LEDs (2019-01-01),
4. 10134965 - Passivation for a semiconductor light emitting device (2018-11-20),
5. 10134964 - Passivation for a semiconductor light emitting device (2018-11-20),
6. 10056531 - Method of processing a semiconductor structure (2018-08-21),
7. 9722161 - P-n separation metal fill for flip chip LEDs (2017-08-01),
8. 9722137 - LED having vertical contacts redistributed for flip chip mounting (2017-08-01),
9. 9705047 - Method of attaching a light emitting device to a support substrate (2017-07-11),
10. 9431581 - Method of attaching a light emitting device to a support substrate (2016-08-30),
11. 9219209 - P-N separation metal fill for flip chip LEDs (2015-12-22),
12. 9153758 - Method of attaching a light emitting device to a support substrate (2015-10-06),
13. 8951817 - Light emitting device chip scale package (2015-02-10),
14. 8471282 - Passivation for a semiconductor light emitting device (2013-06-25),
15. 8450754 - Series connected flip chip LEDs with growth substrate removed (2013-05-28),

Title: The Innovative Journey of Daniel Alexander Steigerwald

Introduction: Daniel Alexander Steigerwald, a visionary inventor based in Cupertino, CA, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Daniel Alexander Steigerwald holds several patents in the field of artificial intelligence and renewable energy technologies, showcasing his commitment to creating a sustainable future.

Career Highlights: With a background in engineering and a passion for pushing the boundaries of what is possible, Steigerwald has led numerous successful projects that have revolutionized industries.

Collaborations: Throughout his career, Daniel Alexander Steigerwald has collaborated with leading tech companies and research institutions to bring his ideas to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Daniel Alexander Steigerwald's relentless pursuit of innovation and his dedication to creating a positive impact on the world make him a true pioneer in the field of technology.

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