Daniel Alexander Steigerwald

This inventor holds 54 USPTO granted patents and 3 published patent applications and 6 EPO patents, primarily in Semiconductor LEDs (CPC class H01L). Top assignees: Lumileds Lighting U.s., LLC, Koninklijke Philips Corporation N.v., Philips Lumileds Lighting Company LLC. Active years: 1999-2023.

USPTO Granted Patents = 54 (Patent Applications = 3)

% Patents Active = 94.4

EPO Patents = 6 (Patent Applications = 3)

Average Co-Inventor Count = 3.6

ph-index = 25

Forward Citations = 2,712(Granted Patents)

Forward Citations (Not Self Cited) = 2,656(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Eindhoven, NL (2015 - 2017)
San Jose, CA (US) (2017 - 2019)
Cupertino, CA (US) (1999 - 2023)

Company Filing History:

29 out of 133

Lumileds Lighting U.s., LLC

patents

13 out of 21,857

Koninklijke Philips Corporation N.v.

patents

11 out of 222

Philips Lumileds Lighting Company LLC

Hewlett-Packard Company

patents

where one patent can have more than one assignee

Years Active: 1999-2023

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Areas of Expertise:

Passivation

Flip Chip

LED Assembly

High-Powered

Thermal Properties

Optical Scattering

Interconnects

Ohmic Contacts

Luminous Efficiency

Multi-Chip

Reliability

Photoresist Patterns

54 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 11658273 - Passivation for a semiconductor light emitting device (2023-05-23),

2. 10873013 - Passivation for a semiconductor light emitting device (2020-12-22),

3. 10170675 - P—N separation metal fill for flip chip LEDs (2019-01-01),

4. 10134965 - Passivation for a semiconductor light emitting device (2018-11-20),

5. 10134964 - Passivation for a semiconductor light emitting device (2018-11-20),

6. 10056531 - Method of processing a semiconductor structure (2018-08-21),

7. 9722161 - P-n separation metal fill for flip chip LEDs (2017-08-01),

8. 9722137 - LED having vertical contacts redistributed for flip chip mounting (2017-08-01),

9. 9705047 - Method of attaching a light emitting device to a support substrate (2017-07-11),

10. 9431581 - Method of attaching a light emitting device to a support substrate (2016-08-30),

11. 9219209 - P-N separation metal fill for flip chip LEDs (2015-12-22),

12. 9153758 - Method of attaching a light emitting device to a support substrate (2015-10-06),

13. 8951817 - Light emitting device chip scale package (2015-02-10),

14. 8471282 - Passivation for a semiconductor light emitting device (2013-06-25),

15. 8450754 - Series connected flip chip LEDs with growth substrate removed (2013-05-28),

Title: The Innovative Journey of Daniel Alexander Steigerwald

Introduction: Daniel Alexander Steigerwald, a visionary inventor based in Cupertino, CA, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Daniel Alexander Steigerwald holds several patents in the field of artificial intelligence and renewable energy technologies, showcasing his commitment to creating a sustainable future.

Career Highlights: With a background in engineering and a passion for pushing the boundaries of what is possible, Steigerwald has led numerous successful projects that have revolutionized industries.

Collaborations: Throughout his career, Daniel Alexander Steigerwald has collaborated with leading tech companies and research institutions to bring his ideas to life, demonstrating his ability to work effectively in multidisciplinary teams.

Conclusion: Daniel Alexander Steigerwald's relentless pursuit of innovation and his dedication to creating a positive impact on the world make him a true pioneer in the field of technology.