The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 30, 2016
Filed:
Sep. 29, 2015
Applicant:
Koninklijke Philips N.v., Eindhoven, NL;
Inventors:
Daniel Alexander Steigerwald, Eindhoven, NL;
Jerome Chandra Bhat, Eindhoven, NL;
Salman Akram, Eindhoven, NL;
Assignee:
Koninklijke Philips N.V., Eindhoven, NL;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 33/48 (2010.01); H01L 33/62 (2010.01); H01L 33/50 (2010.01); H01L 25/075 (2006.01); H01L 25/00 (2006.01); H01L 33/46 (2010.01); H01L 33/58 (2010.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 33/483 (2013.01); H01L 25/075 (2013.01); H01L 25/50 (2013.01); H01L 33/46 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01); H01L 33/62 (2013.01); H01L 33/0079 (2013.01); H01L 2224/16 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A method according to embodiments of the invention includes providing a wafer of semiconductor light emitting devices, each semiconductor light emitting device including a light emitting layer sandwiched between an n-type region and a p-type region. A wafer of support substrates is provided, each support substrate including a body. The wafer of semiconductor light emitting devices is bonded to the wafer of support substrates. Vias are formed extending through the entire thickness of the body of each support substrate.