IDiyas

For the Inventor, By the Inventor

Campbell, CA, United States of America

Conor O'Sullivan

USPTO Granted Patents = 82 

Average Co-Inventor Count = 26.0

ph-index = 8

Forward Citations = 254(Granted Patents)

DiyaCoin DiyaCoin = 0.03 


Inventors with similar research interests:


Company Filing History:

goldMedal82 out of 203 
 
Pdf Solutions, Incorporated
 patents

Years Active: 2017-2021

where 'Filed Patents' based on already Granted Patents

82 patents (USPTO):
1. 11107804 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-31),
2. 11081477 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
3. 11081476 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-08-03),
4. 11075194 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-07-27),
5. 11018126 - IC with test structures and e-beam pads embedded within a contiguous standard cell area (2021-05-25),
6. 10978438 - IC with test structures and E-beam pads embedded within a contiguous standard cell area (2021-04-13),
7. 10854522 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-side short or leakage, at least one corner short or leakage, and at least one via open or resistance, where such measurements are obtained from non-contact pads associated with respective tip-to-side short, corner short, and via open test areas (2020-12-01),
8. 10777472 - IC with test structures embedded within a contiguous standard cell area (2020-09-15),
9. 10593604 - Process for making semiconductor dies, chips, and wafers using in-line measurements obtained from DOEs of NCEM-enabled fill cells (2020-03-17),
10. 10290552 - Methods for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective tip-to-tip short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-05-14),
11. 10269786 - Integrated circuit containing first and second DOEs of standard Cell Compatible, NCEM-enabled Fill Cells, with the first DOE including tip-to-side short configured fill cells, and the second DOE including corner short configured fill cells (2019-04-23),
12. 10211112 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one side-to-side short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side short, and side-to-side short test areas (2019-02-19),
13. 10211111 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one tip-to-side short or leakage, and at least one corner short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, tip-to-side sort, and corner short test areas (2019-02-19),
14. 10199294 - Method for processing a semiconductor wafer using non-contact electrical measurements indicative of a least one side-to-side short or leakage, at least one via-chamfer short or leakage, and at least one corner short or leakage, where such measurements are obtained from cells with respective side-to-side short, via-chamfer short, and corner short test areas, using a charged particle-beam inspector with beam deflection to account for motion of the stage (2019-02-05),
15. 10199293 - Method for processing a semiconductor water using non-contact electrical measurements indicative of at least one tip-to-tip short or leakage, at least one side-to-side short or leakage, and at least one chamfer short or leakage, where such measurements are obtained from non-contact pads associated with respective tip-to-tip short, side to side short, and chamfer short test areas (2019-02-05),

Title: Conor O'Sullivan: A Talent Shaping Advanced IC Manufacturing

Introduction:

In the fast-paced world of advanced IC manufacturing, innovation and patenting play vital roles in pushing the boundaries of technology. Among the exceptional innovators in this field is Conor O'Sullivan, a skilled inventor and contributor to cutting-edge developments in Campbell, CA (US).

Latest Patents:

Conor O'Sullivan's impressive portfolio boasts an astounding 82 patents, with his latest inventions showcasing his expertise in IC design and testing. One such patent is an IC with test structures and e-beam pads embedded within a contiguous standard cell area. This invention enables advanced manufacturing processes while incorporating an associated e-beam testable structure. The seamless integration of e-beam pads into the standard cell area highlights Conor's commitment to pushing technological limits in IC design.

Career Highlights:

Conor O'Sullivan's professional journey has been nothing short of remarkable, with Pdf Solutions, Incorporated serving as the platform for his groundbreaking work. Pdf Solutions, Inc. is at the forefront of providing comprehensive solutions for semiconductor companies worldwide, and Conor has made substantial contributions to their mission.

Collaborations:

In such a dynamic industry, collaboration plays a critical role in driving innovation. Conor O'Sullivan has had the privilege of working alongside accomplished individuals who share his passion for advancements in IC manufacturing. Notable among his colleagues are Stephen Lam and Dennis Ciplickas, whose expertise and collaborative efforts have undoubtedly contributed to their collective success.

Conclusion:

Conor O'Sullivan continues to make significant strides in the world of IC manufacturing, leaving an indelible mark with his inventive spirit and dedication to advancement. His numerous patents, including the groundbreaking IC design incorporating e-beam pads, reflect his commitment to pushing technological boundaries. With his contributions and collaborative endeavors, Conor is shaping the future of the industry alongside Pdf Solutions, Inc. and his esteemed colleagues.

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