Chun-Cheng Liao

Title: Innovations of Chun-Cheng Liao

Introduction

Chun-Cheng Liao is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor technology, holding a total of 11 patents. His work focuses on enhancing semiconductor device structures and improving their efficiency.

Latest Patents

Among his latest patents is a semiconductor device with redistribution plugs. This invention discloses a semiconductor device that includes a first chip with a first substrate and a first redistribution layer. It features a first lower bonding pad positioned on the first redistribution layer and a second lower bonding pad above the first substrate. Additionally, a second chip is included, which has a dense region and a loose region adjacent to it. The device incorporates upper pads on the bonding pads, second redistribution layers on the upper pads, and redistribution plugs with varying aspect ratios.

Another notable patent is the semiconductor device structure with a silicide portion between conductive plugs. This structure consists of a first dielectric layer over a semiconductor substrate and a second dielectric layer above it. It includes conductive plugs and a silicide portion situated between them, enhancing the device's performance.

Career Highlights

Chun-Cheng Liao is currently employed at Nan Ya Technology Corporation, where he continues to innovate in semiconductor technology. His work has been instrumental in advancing the capabilities of semiconductor devices, making them more efficient and reliable.

Collaborations

Chun-Cheng collaborates with Yuan-Hsun Wu, contributing to various projects and innovations in the semiconductor field.

Conclusion

Chun-Cheng Liao's contributions to semiconductor technology through his patents and work at Nan Ya Technology Corporation highlight his role as a leading inventor in the industry. His innovations continue to shape the future of semiconductor devices.