The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Sep. 03, 2024
Filed:
Nov. 08, 2021
Applicant:
Nanya Technology Corporation, New Taipei, TW;
Inventor:
Chun-Cheng Liao, New Taipei, TW;
Assignee:
NANYA TECHNOLOGY CORPORATION, New Taipei, TW;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/768 (2006.01); H01L 23/522 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76897 (2013.01); H01L 21/7685 (2013.01); H01L 21/76864 (2013.01); H01L 21/76885 (2013.01); H01L 23/5226 (2013.01);
Abstract
A method for preparing a semiconductor device structure includes forming a first dielectric layer over a semiconductor substrate; forming a first conductive plug in the first dielectric layer; forming a polysilicon layer covering the first dielectric layer and the first conductive plug; transforming a portion of the polysilicon layer into a silicide portion; forming a second conductive plug directly over the silicide portion; and forming a second dielectric layer surrounding the second conductive plug.