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For the Inventor, By the Inventor

Freiberg, Germany

Christian Beyer

This inventor holds 34 USPTO granted patents and 4 published patent applications and 19 EPO patents, primarily in Wafer Production. Top assignees: Siltectra Gmbh, Infineon Technologies Ag, Joint Solar Silicon Gmbh & Co. Kg. Active years: 2010-2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Christian Beyer. Retrieved from https://idiyas.com/inventor/christian-beyer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 34 

% Patents Active = 91.2

 

Average Co-Inventor Count = 2.8

ph-index = 3

Forward Citations = 37(Granted Patents)


Location History:

  • Dresden, DE (2019 - 2021)
  • Freiberg, DE (2010 - 2024)

Company Filing History:

goldMedal30 out of 48 
 
Siltectra Gmbh
 patents
silverMedal2 out of 15,027 
 
Infineon Technologies Ag
 patents
bronzeMedal1 out of 3 
 
Joint Solar Silicon Gmbh & Co. Kg
 patents
4. 1 out of 834,513 
Other
 patents

Years Active: 2010-2026

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Areas of Expertise:
Wafer Production
Solid-State Materials
Laser Modification
Semiconductor Wafers
Thickness Reduction
Separation Techniques
Crystal Lattice
Multi-Component Arrangement
Donor Substrate
Pressure Application
Material Conversion
Hybrid Materials
34 patents (USPTO):Explore Patents
1. 12741341 - Method for producing a detachment region in a solid-state body (2026-09-22),
2. 12690429 - Method for producing a layer of solid material (2026-07-21),
3. RE50809 - Method of modifying a solid using laser light (2026-03-03),
4. 12356700 - Method for splitting semiconductor wafers (2025-07-08),
5. 12211702 - Solid body and multi-component arrangement (2025-01-28),
6. 12159805 - Method for producing wafers with modification lines of defined orientation (2024-12-03),
7. 12151314 - Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack (2024-11-26),
8. 12097641 - Method for forming a crack in an edge region of a donor substrate (2024-09-24),
9. 12030216 - Method for separating wafers from donor substrates (2024-07-09),
10. 11996331 - Method for separating a solid body (2024-05-28),
11. 11869810 - Method for reducing the thickness of solid-state layers provided with components (2024-01-09),
12. 11833617 - Splitting of a solid using conversion of material (2023-12-05),
13. 11787083 - Production facility for separating wafers from donor substrates (2023-10-17),
14. 11699616 - Method for producing a layer of solid material (2023-07-11),
15. 11527441 - Method for producing a detachment area in a solid body (2022-12-13),

Title: Christian Beyer - Innovative Inventor from Freiberg

Introduction: Christian Beyer is a renowned inventor hailing from Freiberg, Germany, known for his groundbreaking contributions to various fields of technology and science.

Latest Patents: Christian Beyer holds several patents in the areas of renewable energy, sustainable materials, and advanced manufacturing processes, showcasing his commitment to innovation.

Career Highlights: With a career spanning over two decades, Christian Beyer has worked with leading research institutions and universities to develop cutting-edge technologies that have revolutionized the industry.

Collaborations: Throughout his career, Christian Beyer has collaborated with top companies, banks, and innovative startups to bring his inventions to the market, fostering a culture of creativity and progress.

Conclusion: Christian Beyer's passion for innovation and his dedication to pushing the boundaries of what is possible make him a true pioneer in the world of inventions.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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