The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Sep. 24, 2024

Filed:

Mar. 26, 2021
Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Marko David Swoboda, Dresden, DE;

Christian Beyer, Freiberg, DE;

Franz Schilling, Radeberg, DE;

Jan Richter, Dresden, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B28D 1/22 (2006.01); B23K 26/00 (2014.01); B23K 26/53 (2014.01); B23K 101/40 (2006.01); B28D 5/00 (2006.01); B81C 1/00 (2006.01); C03B 33/02 (2006.01); C03B 33/09 (2006.01); H01L 21/02 (2006.01); H01L 21/268 (2006.01); H01L 21/304 (2006.01); H01L 21/762 (2006.01); H01L 31/18 (2006.01);
U.S. Cl.
CPC ...
B28D 1/221 (2013.01); B23K 26/0006 (2013.01); B23K 26/53 (2015.10); B28D 5/0005 (2013.01); B81C 1/00634 (2013.01); C03B 33/0222 (2013.01); H01L 21/02005 (2013.01); H01L 21/268 (2013.01); H01L 21/304 (2013.01); H01L 31/1804 (2013.01); H01L 31/1896 (2013.01); B23K 2101/40 (2018.08); C03B 33/091 (2013.01); H01L 21/76251 (2013.01);
Abstract

A method for separating a solid-body layer from a donor substrate includes providing a donor substrate having a planar surface, a longitudinal axis orthogonal to the planar surface, and a peripheral surface, and producing modifications within the donor substrate using at least one LASER beam. The at least one LASER beam penetrates the donor substrate via the peripheral surface at an angle not equal to 90° relative to the longitudinal axis of the donor substrate. The method further includes producing a stress-inducing polymer layer on the planar surface of the donor substrate, and producing mechanical stresses in the donor substrate by a thermal treatment of the stress-inducing polymer layer. The mechanical stresses produce a crack for separating the solid-body layer, and wherein the crack propagates along the modifications.


Find Patent Forward Citations

Loading…