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For the Inventor, By the Inventor

Dresden, Germany

Siltectra Gmbh


USPTO Granted Patents = 48


Forward Citations = 37

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10 inventors (with patents filed for the assignee):

goldMedal Jan Richter (39 out of 41 patents)

silverMedal Christian Beyer (30 out of 34 patents)

bronzeMedal Marko Swoboda (19 out of 26 patents)

4.  Ralf Rieske (16 out of 20 patents)

5.  Wolfram Drescher (16 out of 26 patents)

6.  Franz Schilling (7 out of 7 patents)

7.  Lukas Lichtensteiger (7 out of 8 patents)

8.  Albrecht Ullrich (4 out of 7 patents)

9.  Anas Ajaj (2 out of 2 patents)

10.  Christoph Guenther (1 out of 1 patent)

11.  Marco Swoboda (0 patent)

12.  Hau-Kit Man (0 patent)

13.  Christoph GÜNTHER (0 patent)


Core Competencies:
Wafer Production
Solid-State Body
Laser Treatment
Separation Method
Thickness Reduction
Composite Structures
Crack Guidance
Material Conversion
Substrate Modification
Thin Layers
Nonplanar Wafer
Pressure Application

48 patents:

1. 12741341 - Method for producing a detachment region in a solid-state body (2026-09-22),
2. 12690429 - Method for producing a layer of solid material (2026-07-21),
3. RE50809 - Method of modifying a solid using laser light (2026-03-03),
4. 12539565 - Method for producing short subcritical cracks in solid bodies (2026-02-03),
5. 12211702 - Solid body and multi-component arrangement (2025-01-28),
6. 12159805 - Method for producing wafers with modification lines of defined orientation (2024-12-03),
7. 12151314 - Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack (2024-11-26),
8. 12097641 - Method for forming a crack in an edge region of a donor substrate (2024-09-24),
9. 12030216 - Method for separating wafers from donor substrates (2024-07-09),
10. 11996331 - Method for separating a solid body (2024-05-28),
11. 11869810 - Method for reducing the thickness of solid-state layers provided with components (2024-01-09),
12. 11833617 - Splitting of a solid using conversion of material (2023-12-05),
13. 11822307 - Laser conditioning of solid bodies using prior knowledge from previous machining steps (2023-11-21),
14. 11787083 - Production facility for separating wafers from donor substrates (2023-10-17),
15. 11786995 - Nonplanar wafer and method for producing a nonplanar wafer (2023-10-17),
Company Overview
Siltectra GmbH, based in Dresden, Germany, specializes in advanced wafer production technologies. The company focuses on innovative methods such as laser treatment and solid body separation to enhance material conversion processes. Their expertise extends to stress-induced cracking and the development of composite structures, enabling the creation of nonplanar wafers. Siltectra's cutting-edge solutions aim to improve efficiency and performance in semiconductor manufacturing and other high-tech applications, positioning them as a leader in the field.
Profile summary synthesized from public USPTO records and patent filings.

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USPTO Data Jan 1 1976 - Oct 6 2026

Siltectra Gmbh USPTO Patent Assignee Logo
48 Patents

#11 in Dresden

#1,104 in Germany

#14,536 in the World

Dresden, DE
Dresden, Germany

Siltectra Gmbh

Forward Citations = 37

10 inventors:

goldMedal Jan Richter (39 out of 41 patents)

silverMedal Christian Beyer (30 out of 34 patents)

bronzeMedal Marko Swoboda (19 out of 26 patents)

4.  Ralf Rieske (16 out of 20 patents)

5.  Wolfram Drescher (16 out of 26 patents)

IDiyas Innovation Intelligence. (2026). Company Patent Portfolio: Siltectra Gmbh. Retrieved from https://idiyas.com/company/siltectra

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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