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For the Inventor, By the Inventor

Dresden, Germany

Siltectra Gmbh


USPTO Granted Patents = 44


Trademarks = 1

Forward Citations = 28

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10 inventors (with patents filed for the assignee):

goldMedal Jan Richter (36 out of 38 patents)

silverMedal Christian Beyer (27 out of 31 patents)

bronzeMedal Marko Swoboda (18 out of 24 patents)

4.  Wolfram Drescher (15 out of 25 patents)

5.  Ralf Rieske (14 out of 18 patents)

6.  Franz Schilling (7 out of 7 patents)

7.  Lukas Lichtensteiger (7 out of 8 patents)

8.  Albrecht Ullrich (3 out of 6 patents)

9.  Anas Ajaj (2 out of 2 patents)

10.  Christoph Guenther (1 out of 1 patent)

11.  Marco Swoboda (0 patent)

12.  Hau-Kit Man (0 patent)

13.  Christoph GÜNTHER (0 patent)


Core Competencies:
Wafer Production
Laser Treatment
Solid Body Separation
Thin Layer Separation
Material Conversion
Stress-Induced Cracking
Composite Structures
Nonplanar Wafer
Solid-State Layer Thinning
Crystal Lattice Modification
Polymer Hybrid Materials
Temperature-Induced Stresses

44 patents:

1. 12211702 - Solid body and multi-component arrangement (2025-01-28),
2. 12159805 - Method for producing wafers with modification lines of defined orientation (2024-12-03),
3. 12151314 - Device and method for applying pressure to stress-producing layers for improved guidance of a separation crack (2024-11-26),
4. 12097641 - Method for forming a crack in an edge region of a donor substrate (2024-09-24),
5. 12030216 - Method for separating wafers from donor substrates (2024-07-09),
6. 11996331 - Method for separating a solid body (2024-05-28),
7. 11869810 - Method for reducing the thickness of solid-state layers provided with components (2024-01-09),
8. 11833617 - Splitting of a solid using conversion of material (2023-12-05),
9. 11822307 - Laser conditioning of solid bodies using prior knowledge from previous machining steps (2023-11-21),
10. 11787083 - Production facility for separating wafers from donor substrates (2023-10-17),
11. 11786995 - Nonplanar wafer and method for producing a nonplanar wafer (2023-10-17),
12. 11772201 - Method for separating solid body layers from composite structures made of SiC and a metallic coating or electrical components (2023-10-03),
13. 11699616 - Method for producing a layer of solid material (2023-07-11),
14. 11664277 - Method for thinning solid-body layers provided with components (2023-05-30),
15. 11527441 - Method for producing a detachment area in a solid body (2022-12-13),
Siltectra GmbH is a technology company specializing in advanced wafering solutions. They have developed a unique semiconductor cutting technology called Cold Split, which enables the efficient and cost-effective separation of brittle materials into ultra-thin wafers. With applications in various industries including semiconductor, energy, automotive, and consumer electronics, Siltectra is revolutionizing the way materials are processed and used.
This text is generated by artificial intelligence and may not be accurate.

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USPTO Data Jan 1 1976 - Dec 23 2025

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44 Patents

#10 in Dresden

#1,213 in Germany

#15,286 in the World

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Dresden, Germany

Siltectra Gmbh

Forward Citations = 28

10 inventors:

goldMedal Jan Richter (36 out of 38 patents)

silverMedal Christian Beyer (27 out of 31 patents)

bronzeMedal Marko Swoboda (18 out of 24 patents)

4.  Wolfram Drescher (15 out of 25 patents)

5.  Ralf Rieske (14 out of 18 patents)

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