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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11786995 B1

PDFFull Text
Date of Patent:
Oct. 17, 2023

Filed:

Jan. 13, 2016

Nonplanar wafer and method for producing a nonplanar wafer

Applicant:

Siltectra Gmbh, Dresden, DE;

Inventor:

Jan Richter, Dresden, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Nathaniel E Wiehe

Assistant Examiner:

Spencer H Kirkwood

Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/0622 (2014.01); B28D 1/22 (2006.01); H01L 21/02 (2006.01); B23K 103/00 (2006.01); B23K 26/40 (2014.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/0624 (2015.10); B28D 1/221 (2013.01); H01L 21/02002 (2013.01); B23K 26/40 (2013.01); B23K 2101/40 (2018.08); B23K 2103/52 (2018.08); B23K 2103/56 (2018.08);
Abstract

A method for cutting off at least one portion, in particular a wafer, from a solid body is contemplated. The method includes: modifying the crystal lattice of the solid body by means of a modifier, wherein a number of modifications are produced to form a nonplanar, in particular convex, detachment region in the interior of the solid body, wherein the modifications are produced in accordance with predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the portion and a defined further treatment of the portion, detaching the portion from the solid body.

Find Patent Forward Citations

Richter, Jan. (2023). Nonplanar wafer and method for producing a nonplanar wafer (U.S. Patent No. 11786995). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11786995

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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