The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Oct. 17, 2023
Filed:
Jan. 13, 2016
Applicant:
Siltectra Gmbh, Dresden, DE;
Inventor:
Jan Richter, Dresden, DE;
Assignee:
Siltectra GmbH, Dresden, DE;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/0622 (2014.01); B28D 1/22 (2006.01); H01L 21/02 (2006.01); B23K 103/00 (2006.01); B23K 26/40 (2014.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/0624 (2015.10); B28D 1/221 (2013.01); H01L 21/02002 (2013.01); B23K 26/40 (2013.01); B23K 2101/40 (2018.08); B23K 2103/52 (2018.08); B23K 2103/56 (2018.08);
Abstract
A method for cutting off at least one portion, in particular a wafer, from a solid body is contemplated. The method includes: modifying the crystal lattice of the solid body by means of a modifier, wherein a number of modifications are produced to form a nonplanar, in particular convex, detachment region in the interior of the solid body, wherein the modifications are produced in accordance with predetermined parameters, wherein the predetermined parameters describe a relationship between a deformation of the portion and a defined further treatment of the portion, detaching the portion from the solid body.