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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11822307 B1

PDFFull Text
Date of Patent:
Nov. 21, 2023

Filed:

Jul. 13, 2017

Laser conditioning of solid bodies using prior knowledge from previous machining steps

Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Marko Swoboda, Dresden, DE;

Ralf Rieske, Dresden, DE;

Jan Richter, Dresden, DE;

Franz Schilling, Radeberg, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Kenneth M Lo

Assistant Examiner:

Tameem D Siddiquee

Int. Cl.
CPC ...
H01L 21/66 (2006.01); H01L 21/78 (2006.01); H01L 21/67 (2006.01); H01L 21/268 (2006.01); B23K 26/03 (2006.01); B23K 26/04 (2014.01); B23K 26/53 (2014.01); G05B 19/18 (2006.01); B23K 103/00 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
G05B 19/182 (2013.01); B23K 26/03 (2013.01); B23K 26/032 (2013.01); B23K 26/043 (2013.01); B23K 26/53 (2015.10); H01L 21/268 (2013.01); H01L 21/67253 (2013.01); H01L 21/7806 (2013.01); H01L 22/12 (2013.01); H01L 22/20 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); G05B 2219/45165 (2013.01);
Abstract

The present invention relates to a method for generating control data for the secondary machining of a solid body (), in particular wafer, which is modified by means of laser beams (). The interior of said solid body () has multiple modifications (), said modifications () having been produced by means of laser beams (). The method comprises the following steps: defining a criterion of analysis for analyzing the modifications () produced in the interior of the solid body (); defining a threshold value with respect to the criterion of analysis, an analytical value on one side of the threshold value triggering a secondary machining registration; analyzing the wafer by means of an analytical unit (), said analytical unit () analyzing the modifications () with respect to the criterion of analysis and outputting analytical values regarding the analyzed modifications, said analytical values lying above or below the threshold value; outputting location data with respect to the analyzed modifications, said location data containing information regarding in which region(s) of the solid body () the analytical value lie above or below the threshold value; and generating control data for controlling a laser treatment device () for the secondary machining of the solid body (), said control data comprising at least the location data of the modifications () registered for secondary machining.

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