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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11699616 B1

PDFFull Text
Date of Patent:
Jul. 11, 2023

Filed:

Apr. 02, 2021

Method for producing a layer of solid material

Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Wolfram Drescher, Dresden, DE;

Jan Richter, Dresden, DE;

Christian Beyer, Freiberg, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:

Murphy, Bilak & Homiller, PLLC

Primary Examiner:

Shouxiang Hu

Int. Cl.
CPC ...
H01L 21/76 (2006.01); H01L 21/762 (2006.01); B23K 26/359 (2014.01); H01L 31/18 (2006.01); B28D 5/00 (2006.01); H01L 21/268 (2006.01); B23K 26/40 (2014.01); H01L 21/02 (2006.01); B23K 26/53 (2014.01); B23K 26/0622 (2014.01); H01L 23/544 (2006.01); H01L 23/00 (2006.01); B23K 26/00 (2014.01); C30B 33/06 (2006.01); B23K 103/00 (2006.01);
U.S. Cl.
CPC ...
H01L 21/76259 (2013.01); B23K 26/0624 (2015.10); B23K 26/359 (2015.10); B23K 26/40 (2013.01); B23K 26/53 (2015.10); B28D 5/0005 (2013.01); B28D 5/0011 (2013.01); H01L 21/02002 (2013.01); H01L 21/268 (2013.01); H01L 21/76254 (2013.01); H01L 23/544 (2013.01); H01L 23/562 (2013.01); H01L 31/1892 (2013.01); H01L 31/1896 (2013.01); B23K 26/0006 (2013.01); B23K 2103/50 (2018.08); B23K 2103/56 (2018.08); C30B 33/06 (2013.01); H01L 2223/5446 (2013.01); Y02E 10/50 (2013.01);
Abstract

A method for producing a layer of solid material includes: providing a solid body having opposing first and second surfaces, the second surface being part of the layer of solid material; generating defects by means of multiphoton excitation caused by at least one laser beam penetrating into the solid body via the second surface and acting in an inner structure of the solid body to generate a detachment plane, the detachment plane including regions with different concentrations of defects; providing a polymer layer on the solid body; and generating mechanical stress in the solid body such that a crack propagates in the solid body along the detachment plane and the layer of solid material separates from the solid body along the crack.

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