The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jan. 09, 2024

Filed:

Jan. 15, 2018
Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Marko Swoboda, Dresden, DE;

Ralf Rieske, Dresden, DE;

Christian Beyer, Freiberg, DE;

Jan Richter, Dresden, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/78 (2006.01); B23K 26/0622 (2014.01); B23K 26/00 (2014.01); B28D 5/00 (2006.01); B23K 26/53 (2014.01); B23K 26/40 (2014.01); C30B 33/00 (2006.01); C30B 31/20 (2006.01); B23K 103/00 (2006.01); C30B 29/36 (2006.01); H01L 29/16 (2006.01); H01L 29/78 (2006.01); H01L 29/872 (2006.01); B23K 101/40 (2006.01);
U.S. Cl.
CPC ...
H01L 21/7813 (2013.01); B23K 26/0006 (2013.01); B23K 26/0624 (2015.10); B23K 26/40 (2013.01); B23K 26/53 (2015.10); B28D 5/0011 (2013.01); C30B 31/20 (2013.01); C30B 33/00 (2013.01); B23K 2101/40 (2018.08); B23K 2103/56 (2018.08); C30B 29/36 (2013.01); H01L 29/1608 (2013.01); H01L 29/7802 (2013.01); H01L 29/872 (2013.01);
Abstract

The invention relates to a method for separating at least one solid-state layer () from at least one solid (). The method according to the invention includes the steps of: producing a plurality of modifications () by means of laser beams in the interior of the solid () in order to form a separation plane (); producing a composite structure by arranging or producing layers and/or components () on or above an initially exposed surface () of the solid (), the exposed surface () being part of the solid-state layer () to be separated; introducing an external force into the solid () in order to create stresses in the solid (), the external force being so great that the stresses cause a crack to propagate along the separation plane (), wherein the modifications for forming the separation plane () are produced before the composite structure is produced.


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