The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Nov. 26, 2024

Filed:

Aug. 10, 2018
Applicant:

Siltectra Gmbh, Dresden, DE;

Inventors:

Marko Swoboda, Dresden, DE;

Ralf Rieske, Dresden, DE;

Christian Beyer, Freiberg, DE;

Jan Richter, Dresden, DE;

Assignee:

Siltectra GmbH, Dresden, DE;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
B23K 26/53 (2014.01); B23K 26/14 (2014.01); B23K 26/146 (2014.01); B23K 26/70 (2014.01); B28D 5/00 (2006.01); H01L 29/16 (2006.01);
U.S. Cl.
CPC ...
B23K 26/53 (2015.10); B23K 26/14 (2013.01); B23K 26/146 (2015.10); B23K 26/70 (2015.10); B28D 5/0011 (2013.01); H01L 29/1608 (2013.01);
Abstract

The present invention relates to a method, according to claim, for separating at least one solid body layer (), particularly a solid body disk, from a donor substrate (). The method according to the invention comprises preferably at least the following steps: providing a donor substrate (); producing or arranging a stress-producing layer () on a particularly flat surface () of the donor substrate () which axially defines the donor substrate (); pressing at least one pressure application element () of a pressure application device () onto at least one pre-determined portion of the stress-producing layer (), in order to press the stress-producing layer () onto the surface (); separating the solid body layer () from the donor substrate () by thermally applying the stress-producing layer (), thereby producing mechanical stress in the donor substrate (), the mechanical stress creating a crack for separating a solid body layer (), and the pressure application element () being pressed onto the stress-producing layer () during the thermal application of the stress-producing layer ().


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