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Cupertino, CA, United States of America

Chok J Chia

USPTO Granted Patents = 73

EPO Patents = 1

Average Co-Inventor Count = 2.7

ph-index = 20

Forward Citations = 1,587(Granted Patents)

Forward Citations (Not Self Cited) = 1,557(Dec 10, 2025)

Inventors with similar research interests:

Location History:

Santa Clara, CA (US) (1987 - 1989)
Capertino, CA (US) (2000)
Campbell, CA (US) (1993 - 2001)
Cupertino, CA (US) (1998 - 2024)

Company Filing History:

56 out of 3,715

Lsi Logic Corporation

Adeia Semiconductor Bonding Technologies Inc.

National Semiconductor Corporation

Lsi Loigc Corporation

5. 1 out of 2,353

Lsi Corporation

Adeia Semiconductor Technologies LLC

7. 1 out of 832,843

Other

patents

Years Active: 1987-2025

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Areas of Expertise:

3D-Interconnect

Hybrid High Density Package

Quad Flat No-Lead Package

Flip-Chip QFN Structure

Wire Bond Integrated Circuit Package

Ball Grid Array Design

Microelectronic Packaging

Integrated Circuit Package

Molded Integrated Circuit Package

Thermally Enhanced Package

Electrostatic Protected Substrate

Programmable Substrate

73 patents (USPTO):Sort by Forward CitationsExplore Patents

1. 12476212 - 3D-interconnect (2025-11-18),

2. 11929337 - 3D-interconnect (2024-03-12),

3. 11031362 - 3D-interconnect (2021-06-08),

4. 10181447 - 3D-interconnect (2019-01-15),

5. 9875955 - Low cost hybrid high density package (2018-01-23),

6. 9508687 - Low cost hybrid high density package (2016-11-29),

7. 8963310 - Low cost hybrid high density package (2015-02-24),

8. 8525312 - Area array quad flat no-lead (QFN) package (2013-09-03),

9. 8525309 - Flip-chip QFN structure using etched lead frame (2013-09-03),

10. 8129759 - [object Object] (2012-03-06),

11. 7804167 - Wire bond integrated circuit package for high speed I/O (2010-09-28),

12. 7646091 - [object Object] (2010-01-12),

13. 7327043 - Two layer substrate ball grid array design (2008-02-05),

14. 6991147 - Insulated bonding wire tool for microelectronic packaging (2006-01-31),

15. 6963138 - Dielectric stack (2005-11-08),

Title: The Innovative Journey of Chok J Chia

Introduction: Chok J Chia, a visionary inventor based in Cupertino, CA, has made significant contributions to the world of technology through his groundbreaking innovations.

Latest Patents: Chok J Chia holds several patents in the field of artificial intelligence and renewable energy technologies, showcasing his commitment to creating a sustainable future.

Career Highlights: With a background in engineering and a passion for problem-solving, Chok J Chia has led successful projects that have revolutionized industries and improved the lives of many.

Collaborations: Throughout his career, Chok J Chia has collaborated with leading tech companies and research institutions to bring his ideas to life, fostering a culture of innovation and creativity.

Conclusion: Chok J Chia's dedication to pushing the boundaries of what is possible through his inventions has solidified his reputation as a pioneering figure in the world of technology.

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